Leading chipmakers Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced plans to adopt ASML’s latest chipmaking machines in the next several years—and they also joined Intel in agreeing to a crucial technology change that could boost chip production on the new machines by 40 percent.
This signifies the semiconductor industry’s broader embrace of high NA EUV photolithography technology that can cost up to $400 million per machine and is only provided by the Dutch technology company ASML, Bloomberg reports. The technology would allow chip designers to implement even smaller features in potentially more powerful and efficient next-generation chips produced for AI data centers and consumer electronics such as smartphones, tablets, and laptops.
ASML’s EUV (extreme ultraviolet) lithography machines enable chipmakers to use powerful laser light to imprint patterns in silicon wafers, layer by layer, and gradually form the computer circuitry that makes silicon chips work. Compared to older deep ultraviolet lithography, EUV technology harnesses a more powerful source of light with a shorter wavelength to create even smaller features on silicon wafers.
Leading chipmakers Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced plans to adopt ASML’s latest chipmaking machines in the next several years—and they also joined Intel in agreeing to a crucial technology change that could boost chip production on the new machines by 40 percent.
This signifies the semiconductor industry’s broader embrace of high NA EUV photolithography technology that can cost up to $400 million per machine and is only provided by the Dutch technology company ASML, Bloomberg reports. The technology would allow chip designers to implement even smaller features in potentially more powerful and efficient next-generation chips produced for AI data centers and consumer electronics such as smartphones, tablets, and laptops.
ASML’s EUV (extreme ultraviolet) lithography machines enable chipmakers to use powerful laser light to imprint patterns in silicon wafers, layer by layer, and gradually form the computer circuitry that makes silicon chips work. Compared to older deep ultraviolet lithography, EUV technology harnesses a more powerful source of light with a shorter wavelength to create even smaller features on silicon wafers.
RAM production capacity at Samsung Electronics, SK hynix, and Micron Technology is reportedly committed through the end of 2027, leaving consumer electronics manufacturers with little room to secure additional memory outside existing supply agreements.
Industry reports indicate that the three dominant manufacturers have allocated their available DRAM and high-bandwidth memory production for next year. Long-term contracts with cloud companies, AI chip developers, automakers, and device manufacturers have effectively reserved the output those suppliers expect to produce.
The claim does not mean every RAM module that will be sold in 2027 has already been manufactured or purchased by a consumer. It refers to future production capacity being assigned to customers before the chips leave the factory.
It also does not cover every memory producer worldwide. Chinese manufacturer ChangXin Memory Technologies, known as CXMT, and several smaller suppliers continue to produce DRAM. However, Samsung, SK hynix, and Micron control most of the advanced global DRAM market, making their available capacity the primary constraint for companies such as Apple.
RAM Production Is Already Committed
Selling out a year of production capacity means manufacturers have received enough contractual commitments to allocate the output they expect from their factories. Customers may have reserved specific volumes, product types, or manufacturing capacity under agreements that include minimum purchases and pricing protections.
Micron has been shifting toward this model through strategic customer agreements. The company disclosed 16 multiyear deals covering customers across data centers, consumer devices, automotive products, and industrial equipment.
Those agreements typically run for several years and include binding volume commitments. Some use fixed prices, while others establish price floors and ceilings. Micron has said that its signed contracts represent approximately $100 billion in expected revenue over their remaining terms.
Such agreements give memory manufacturers more predictable revenue than the traditional DRAM cycle, in which aggressive expansion frequently created excess supply and collapsing prices. They also give large buyers assurance that chips will be available for planned products.
The disadvantage falls on customers that did not reserve enough capacity early. A company needing more memory than its contract provides may have to pay higher prices, accept a different specification, delay production, or find another qualified supplier.
SK hynix CEO Kwak Noh-jung has described 2027 as potentially the worst year in the memory industry’s history from a supply perspective. He expects customer demand to remain above the company’s production capacity beyond 2030, despite major investments in new factories.
Samsung has issued a similar warning, expecting the constraints to become more severe in 2027 and continue into 2028. Analysts at UBS have projected that the DRAM market could remain undersupplied until at least the second quarter of 2028.
Image Credit: Bloomberg / Getty Images
AI Memory Consumes More Factory Capacity
The shortage originates primarily from the rapid expansion of artificial intelligence infrastructure. AI accelerators require high-bandwidth memory, or HBM, to move large amounts of data between memory and processors at extremely high speeds.
HBM and the LPDDR memory used in Apple devices are different products. An iPhone or Mac is not competing directly for the same finished memory package installed beside an Nvidia AI accelerator.
They still depend on overlapping manufacturing resources. HBM begins with advanced DRAM dies, and producing a given capacity of stacked HBM consumes considerably more wafer output and packaging resources than conventional memory. Suppliers have also concentrated spending, equipment, and engineering work on the more profitable AI segment.
Every production line converted or optimized for HBM can reduce the industry’s flexibility to make standard server DRAM, PC memory, or mobile LPDDR. New investment may increase total memory output while doing little to relieve the parts of the market serving phones and personal computers.
Cloud companies are willing to enter multiyear agreements and make large financial commitments because a shortage of memory can leave costly AI processors unused. Memory manufacturers therefore have a powerful incentive to prioritize these customers over consumer device companies seeking lower component prices.
The pressure is also moving beyond HBM. AI servers need large quantities of conventional DDR5 memory, while storage systems supporting model training and inference consume enterprise NAND flash. This spreads the shortage across several categories that were previously less exposed to AI infrastructure spending.
Apple Faces Expensive Supply Decisions
Apple purchases enormous volumes of LPDDR memory for the iPhone and iPad, along with memory used across the Mac, Apple Watch, Vision Pro, Apple TV, and HomePod product families. Its size gives it substantial negotiating power, but it cannot purchase capacity that suppliers have already assigned to other customers.
The company has acknowledged that memory prices are continuing to rise. Tim Cook recently characterized the pricing environment as a “hundred-year flood” and said Apple expects to pay more for memory during the September quarter.
Apple has already raised prices across several Mac and iPad models while reducing or removing some high-memory Mac configurations. Although memory availability is not the sole influence on every product decision, eliminating configurations can help a manufacturer concentrate limited components around the models expected to sell in larger volumes.
The design of Apple silicon makes memory allocation especially sensitive. Unified memory is integrated closely with the processor package and cannot be upgraded after purchase. Apple must decide how many chips to secure for each configuration long before customers begin ordering those machines.
A shortage can therefore affect more than the cost of an individual RAM component. It can influence base memory capacities, upgrade pricing, the number of configurations offered, production volume, and the timing of product introductions.
Apple can absorb part of the increase through its margins, negotiate longer agreements, adjust retail pricing, or redesign its product mix. Each option carries a cost. Absorbing higher prices reduces profit per device, while passing them to customers could weaken demand. Restricting configurations risks pushing professional users away from Macs that no longer offer enough unified memory.
The company is reportedly evaluating DRAM from CXMT for products sold in China. Adding a fourth major source could improve access to conventional memory, but qualification takes time because Apple must confirm performance, reliability, manufacturing consistency, and compatibility with its hardware.
The political environment creates another obstacle. US lawmakers have raised national security concerns about American companies purchasing memory from Chinese semiconductor manufacturers. Apple could consequently find that a supplier is technically suitable for China-market products but difficult to introduce across its international supply chain.
Sold Out Does Not Mean Stores Will Be Empty
The reported capacity commitments do not guarantee a universal shortage of finished devices. Apple and other major manufacturers will still receive memory under agreements they have already negotiated.
Products can also continue reaching stores while component prices rise. Manufacturers may reduce discounts, increase retail prices, limit premium configurations, or give priority to their most profitable devices before allowing a shortage to stop production completely.
Contracted capacity can change if customers reduce orders or if AI infrastructure investment slows. Memory makers could redirect production between customers and product categories, although converting lines and qualifying different chips cannot happen immediately.
CXMT could also expand faster than expected, particularly in mainstream DRAM. Its products have reportedly attracted interest from HP, Asus, Acer, Dell, Lenovo, and Apple as established suppliers devote more resources to AI memory. CXMT is unlikely to replace the combined output of Samsung, SK hynix, and Micron during 2027, but it may provide an alternative for products sold outside the United States.
New production facilities offer little immediate relief. Semiconductor factories require construction, equipment installation, process development, yield improvement, and customer qualification before reaching dependable volume.
Micron expects the first wafer output from its initial new Idaho facility around the middle of 2027, with a second facility following in late 2028. Those first wafers will still need to pass through the production ramp and customer qualification process, leaving much of their effect on available device memory for 2028 and later.
In a striking reversal of traditional supply-chain dynamics, China’s ChangXin Memory Technologies (CXMT) has rebuffed Apple’s requests for lower prices on mobile DRAM, according to industry reports. The move underscores a severe shortage in general-purpose memory chips and hands greater negotiation leverage to South Korea’s Samsung Electronics and SK Hynix.
Apple had been exploring CXMT as a potential new supplier of LPDDR5X and other mobile DRAM for upcoming iPhones and smart devices, aiming to ease manufacturing cost pressures amid soaring memory prices. Sources indicate the iPhone maker sought further price reductions during negotiations. CXMT refused, instead holding firm at levels matching or even exceeding those charged by Samsung and SK Hynix.
The Chinese manufacturer’s bold stance stems from robust domestic demand. Companies such as Huawei and Xiaomi have locked in large volumes of CXMT’s DRAM through high-priced, long-term contracts. This push for supply-chain self-reliance has been intensified by ongoing U.S. semiconductor restrictions on China. With strong local orders secured, CXMT has little incentive to accommodate Apple’s stricter quality requirements or discount demands.
The episode highlights a broader market shift. Major memory producers have redirected significant wafer capacity toward high-bandwidth memory (HBM) to meet surging demand from AI servers and accelerators. This has sharply reduced output of conventional DRAM products like DDR5 and LPDDR5X, triggering a pronounced shortage—sometimes called “memflation” — and rapid price increases across the sector.Big tech firms that once used Chinese low-cost alternatives as leverage in annual pricing talks with primary suppliers now find that strategy ineffective. The low-cost “bypass” route has effectively closed, transferring pricing power from device makers to memory manufacturers.
For Samsung and SK Hynix, the developments create a favorable cycle. CXMT’s absorption of substantial Chinese commodity DRAM demand relieves the Korean firms of pressure to supply lower-margin general-purpose chips. They can instead prioritize higher-value AI memory products, including HBM4, LPCAMM2, and enterprise SSDs. Industry observers note that this positions the Korean companies with stronger control over global pricing in negotiations with major customers in the second half of the year.
One semiconductor industry source described the situation as unusual: CXMT is effectively supporting a floor under general DRAM prices while Samsung and SK Hynix consolidate leadership in premium AI memory. As a result, the Korean firms’ operating margins and market influence are expected to strengthen further.
Earlier this year, Apple had lobbied the U.S. government for clearer approval to source from CXMT, which appears on a Pentagon list of companies with alleged Chinese military ties. Memory cost pressures had already prompted Apple to raise prices on some Mac and iPad models. The latest reports suggest any potential deal with CXMT would not deliver the hoped-for cost savings.
MacDailyNews Take: The memory shortage is widely expected to persist well into 2027 and possibly beyond, as new fab capacity takes years to come online and AI-related demand continues to outpace supply growth. In this environment, the balance of power in the DRAM market has tilted decisively toward suppliers, particularly those focused on advanced, high-margin products.
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Parece que a tentativa da Apple de colaborar com a fabricante chinesa de memória CXMT encontrou mais um empecilho no caminho: supostamente, a possível fornecedora demandou os mesmos valores (ou até maiores) pagos pela Maçã à Samsung Electronics e à SK Hynix. A informação veio do site sul-coreano Digital Daily.
O desgaste ocorreu após a Maçã tentar negociar os preços das memórias, tendo seu pedido de redução de preço rejeitado pela CXMT, que manteve preços semelhantes ou até mesmo superiores aos das demais fornecedoras da Apple.
Do lado da chinesa, há alguns motivos para essa postura: a barganha de uma empresa americana com uma série de exigências quanto aos processos de certificação de qualidade contrasta com o conforto do seu domínio do mercado doméstico, já que a fabricante possui contratos de longo prazo sob preços elevados com empresas como a HUAWEI e a Xiaomi.
Os desafios
Mesmo sob forte pressão da Micron e do Senado americano, a negociação com a CXMT (presente na lista de restrições comerciais do Pentágono como uma empresa militar da China, vale lembrar) foi uma alternativa encontrada por Tim Cook para mitigar os efeitos da crise de memória.
De acordo com um executivo da indústria de semicondutores consultado pelo veículo sul-coreano, a postura da CXMT ajudou a estabelecer um piso para os preços praticados com a DRAM 1Dynamic random access memory, ou memória dinâmica de acesso aleatório. convencional, suficiente para que a Samsung e a SK Hynix cobrassem um valor consideravelmente mais alto. Esse conforto mercadológico quanto às fornecedoras ocidentais também diz respeito ao foco de produção para memórias de alto desempenho destinadas a data centers de inteligência artificial (IA), deixando a produção para eletrônicos de consumo em segundo plano — o que naturalmente provoca escassez.
Segundo o analista Tim Culpan, a Apple e seus fornecedores estão correndo contra o relógio para obter chips de memória a tempo do lançamento da próxima geração de iPhones, prevista para ser anunciada no mês que vem. Esse cenário fez com que a Maçã recorresse especialmente à Micron, à Samsung e à SK Hynix. A escassez poderá afetar a disponibilidade do “iPhone 18 Pro” e do “iPhone 18 Pro Max”, embora ainda exista alguma confiança de que a demanda inicial poderá ser suprida.
Resta a dúvida se a Apple seguirá em suas tratativas com a CXMT ou se dará o braço a torcer aos interlocutores estadunidenses dessa história. Em ambos os cenários, infelizmente, parece que a conta irá chegar mais alta ao consumidor final.
A crise no mercado de DRAMs1Dynamic random access memories, ou memórias dinâmicas de acesso aleatório. e HBMs2High bandwidth memories, ou memórias de alta largura de banda., causada pelo boom das empresas de inteligência artificial (IA), pode ter alcançado seu ponto mais dramático até agora, com as produções de todas as três principais fabricantes desses tipos de componentes (Samsung Electronics, SK Hynix e Micron) já tendo sido reservadas para o ano de 2027 inteiro, segundo informações do DIGITIMES.
Além das memórias, outra categoria de componentes que tem sofrido bastante com a demanda causada por data centers de IA é a de chips NAND, muito utilizados em dispositivos de armazenamento flash (como SSDs 3Solid-state drives, ou unidades de estado sólido.). Embora a situação desses chips ainda não esteja tão apertada quanto a das memórias, fontes ouvidas pelo veículo dão conta de que a Samsung Electronics, a Micron e a SanDisk já venderam toda a sua produção para 2026 por preços altíssimos. A Kioxia e a SK Hynix, por sua vez, deverão firmar contratos parecidos com seus clientes até o fim deste mês.
Voltando para o caso das memórias, dados da Counterpoint Research dão conta de que a Samsung Electronics ficou responsável por 39% do mercado de DRAM (por receita) durante o segundo trimestre, seguida pela SK Hynix (com 26%) e pela Micron (25%). Apesar de todo o investimento nessas empresas, os rumores são de que os compradores de componentes estão recebendo apenas 60-70% dos volumes que solicitaram inicialmente, devido à capacidade de produção limitada.
Algumas dessas fornecedoras, é claro, são parceiras de longa data da Apple — que também tem sofrido com essa escassez de componentes, embora tenha conseguido absorver parte do impacto. Enquanto os iPhones têm passado ilesos por essa crise, produtos como os Macs e os iPads viraram alvo de aumentos expressivos de preços — algo que foi classificado por Tim Cook, o atual CEO 4Chief executive officer, ou diretor executivo. da empresa, como “enchente que ocorre uma vez a cada 100 anos”.
Ainda de acordo com o DIGITIMES, todos os compradores concordaram em realizar pagamentos adiantados por esses componentes, tenham eles estabelecido acordos de fornecimento multianuais anteriormente ou não. Ao que tudo indica, isso é uma resposta ao medo que muitas dessas empresas têm de que seus competidores tentem garantir o máximo de capacidade de produção possível — especialmente durante o período entre julho e agosto, que é quando a maior parte dos pedidos é feita.
Por ser uma das principais compradoras de memórias e chips NAND do mercado, é quase certo que a Apple também tenha desembolsado uma boa grana para garantir sua parcela de componentes para 2027, que é quando deveremos ver o “iPhone 20” chegar ao mercado. Não está claro, no entanto, por quanto mais tempo ela absorverá o impacto dos preços inflados — algumas pessoas, inclusive, acreditam que os próximos iPhones poderão ficar até US$300 mais caros por conta dessa crise.
Jensen Huang fechou em Seul uma série de acordos estratégicos com SK Hynix, SK Telecom, Naver, Doosan, LG e Hyundai, reforçando a aposta da Nvidia na Coreia do Sul como pilar central da sua expansão em IA e robótica.
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