Samsung Electronics began sampling its latest high bandwidth memory (HBM) units among selected customers, a chip it asserted helps maximise computing performance for large language models (LLMs) and next-generation AI systems.

Claiming an industry first with the 12-layer HBM4E unit, the company noted the release followed mass production and commercial shipment of its HBM4 earlier this year.

The latest release is said to achieve transfer speeds of up to 16Gb/s with improved energy efficiency and thermal performance.

Samsung head of memory development Sang Joon Hwang said the company had “once again demonstrated its distinct technological edge with HBM4E”.

“Through our advanced manufacturing capabilities and pre-emptive infrastructure investments, we will continue to drive the growth of the global AI memory market.”

Samsung noted the chip “delivers a stable pin speed of 14Gb/s”, a 20% increase over the HBM4. The rate of the latest product can be scaled up to 16Gb/s “to support increasingly intensive data processing requirements,” it added.

The company added its “comprehensive portfolio spanning memory, foundry, logic design and advanced packaging” meant it would be able to “continue to ensure a stable semiconductor supply for the booming AI market”.

Along with peers, Samsung has been reaping the rewards of high demand and associated price rises for memory chips driven by global demand for AI systems.

Samsung booked record quarterly sales for its memory business in Q1, attributed to addressing “high-value-added AI demand despite limited supply availability”.

The post Samsung begins distributing latest HBM chip appeared first on Mobile World Live.

Mobile World Live
Broadcom, Samsung launch 5G, Wi-Fi 8 FWA platform 27 May 2026 at 16:05

Broadcom, Samsung launch 5G, Wi-Fi 8 FWA platform

Mobile World Live

By: Michael Robuck

27 May 2026 at 16:05

Broadcom and Samsung Electronics launched what they claim is the first integrated 5G and Wi-Fi 8 fixed wireless access (FWA) platform, a milestone for the home broadband industry.

The platform uses Broadcom’s BCM6776 Wi-Fi 8 SoC and Samsung’s B1320 5G modem in a reference design for mass-market equipment which is compatible with 3GPP Release-17 and the emerging Wi-Fi 8 IEEE 802.11bn standard.

It is also compatible with new radio and narrowband NTN bands, giving operators a degree of connectivity resilience which the companies noted was previously out of reach for consumer-grade hardware.

Samsung’s B1320 is a 5nm chipset capable of delivering 5G data rates of 3.4Gb/s in the downlink and 1.2Gb/s up.

Broadcom’s BCM6776 is a tri-band, single-chip product covering 2.4GHz, 5GHz and 6GHz simultaneously, with a quad-core Arm network processor and integrated multi-gigabit physical layer.

The design cuts active power consumption by 50% compared with Broadcom’s previous generation.

Broadcom asserted the combination of the 5G modem and Wi-Fi 8 radio into a tightly integrated reference platform can lower OEMs’ bill-of-materials and simplify board design.

It stated Humax Networks and WNC are already producing next-generation gateways using the platform and global operator trials are underway.

Joonsuk Kim, EVP and head of CP development at Samsung Electronics, framed the platform around accessibility, describing it as a tool provide high-quality connectivity “across a wide range of environments”.

Vijay Nagarajan, VP of Broadcom’s marketing, wireless and broadband communications division, pointed to the coordinated performance between 5G and Wi-Fi 8 as a differentiator for operators trying to guarantee consistent coverage in “every corner of the home”.

The post Broadcom, Samsung launch 5G, Wi-Fi 8 FWA platform appeared first on Mobile World Live.

The Guardian - Technology
Samsung memory chip staff in line for £310,000 bonuses after AI profit-sharing deal 27 May 2026 at 12:53

Samsung memory chip staff in line for £310,000 bonuses after AI profit-sharing deal

The Guardian - Technology

By: Graeme Wearden

27 May 2026 at 12:53

Agreement averts strike and shows latest impact of AI boom as two more chipmakers join $1tn club

Employees at Samsung Electronics’ memory chip division are to receive bonuses averaging about £310,000 each through a landmark profit-sharing agreement, as the AI boom drives up chipmakers’ profits.

Fears of a strike at Samsung were averted on Wednesday after two unions for the world’s largest memory chipmaker said 74% of the 62,616 workers who cast their votes had backed the deal.

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