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At 0.8 nanometers, carbon film may replace two layers in future chip wiring

As transistors inside microchips continue to shrink, the metal wiring that connects them is becoming a growing obstacle to faster, more energy-efficient chips. Narrower wires have greater electrical resistance, while smaller gaps between them increase interference between adjacent signals. These effects impede data transfer and raise energy consumptionβ€”an issue known as an interconnect bottleneck, which is especially acute in data-hungry artificial intelligence processors.

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