Daeduck Electronics Posts Record Quarter as Operating Profit Surges 3,599%

Daeduck Electronics reported record quarterly results as demand for semiconductor substrates used in artificial intelligence (AI) servers and data centers continued to expand. Operating profit surged 3,599% from a year earlier.
The company said on July 31 that it posted consolidated revenue of 401.0 billion won and operating profit of 70.3 billion won for the second quarter of 2026. Revenue increased 63% year over year, while operating profit jumped 3,599%. Compared with the previous quarter, revenue rose 16% and operating profit increased 37%.
Operating margin reached 17.5%, up 2.7 percentage points from 14.8% in the first quarter.
Growth was driven by higher sales of high-value semiconductor substrates for AI and data center applications.
"Performance continued to improve on the back of growing demand for high-performance semiconductors in AI and data center markets and strengthened business competitiveness," the company said.
Revenue from the company's core package substrate (PKG) business reached 343.5 billion won, up 65% from a year earlier and 18% from the previous quarter. Demand increased for controllers, optical modules and networking products used in AI data centers. Sales of automotive radar and advanced driver assistance system (ADAS) products also expanded. Improved product mix, higher productivity and favorable foreign exchange rates contributed to profitability.
Revenue from the multilayer board (MLB) business totaled 57.5 billion won, rising 53% year over year and 4% sequentially. The company began mass production of next-generation AI products and saw increased sales for semiconductor inspection equipment and electronic design automation (EDA) applications. Demand for high-margin products in aerospace and defense markets also remained stable.
The company's revenue mix continued to shift toward AI-related products. Flip-chip ball grid array (FC-BGA) substrates accounted for 26% of revenue, up from 23% in the previous quarter. Flip-chip chip-scale package (FC-CSP) products represented 48% of revenue, compared with 46% in the prior quarter, reflecting stronger sales of high-value products for AI servers and data centers.
By contrast, the share of memory-related chip-scale package (CSP) productsβincluding NAND flash, low-power DRAM (LPDDR5), SOCAMM and Compute Express Link (CXL) productsβdeclined to 23% from 25%.
Daeduck Electronics expects growth to continue in the third quarter. The company plans to expand mass production of large-area substrates for AI data centers and accelerate new product development. It also aims to address growing demand for high-performance networking products and physical AI-related applications.

