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Google linked with Samsung deal for next-gen AI chip

Google reportedly is in discussions with Samsung Electronics to manufacture part of its next-generation AI processor, which could include using the latter’s 2-nanometer production technology.

The Information reported Google plans for TSMC to produce the main computing component of its tensor processing unit (TPU), codenamed Icefish, while Samsung may manufacture a component which helps connect it to memory.

Reuters reported the tech giant is also working with chip designer MediaTek on the overall design. Icefish is still in development, with mass production possible as early as 2028.

Landing the deal would be a major boost for Samsung’s foundry ambitions, strengthening an effort to win more advanced chip manufacturing business.

Its 2nm process would allow more transistors to be packed into smaller chips, improving performance, energy efficiency and AI capabilities, Reuters noted. It added the South Korean vendor is also considering a second Texas plant to expand output.

The reports are the latest indication Google is looking to reduce its reliance on TSMC, which is struggling to keep pace with surging AI demand and could prove a bottleneck for the wider industry.

Earlier this week, The Information also reported Google is in talks with Intel to manufacture more than three million TPUs in 2028.

The post Google linked with Samsung deal for next-gen AI chip appeared first on Mobile World Live.

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Google quer reduzir dependência da TSMC e negoceia a produção de um novo chip de IA com a Samsung e Intel

O próximo processador de IA da Google terá uma arquitetura de fabrico dividida. A TSMC deverá produzir o núcleo computacional, cabendo à Samsung o fabrico do componente de interligação à memória. A Intel poderá também entrar na equação com a produção da TPU.

The post Google quer reduzir dependência da TSMC e negoceia a produção de um novo chip de IA com a Samsung e Intel appeared first on Tek Notícias.

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Samsung goes all-in on AI for internal overhaul

Samsung Group unveiled plans for a sweeping transformation of its businesses, introducing AI extensively across its companies covering functions from marketing to manufacturing.

The conglomerate believes widespread adoption across its affiliates, which includes Samsung Electronics, will fundamentally change working style and culture across the organisations.

Samsung highlighted it had pioneered the use of AI in consumer devices and wanted to “strongly apply” it to eight major business processes: development, purchasing, manufacturing, logistics, marketing, sales, service and management support.

“To enhance business competitiveness amid rapidly changing business environments, Samsung plans to officially introduce external generative AI services such as Gemini, ChatGPT, and Claude across all affiliates in June,” the company added.

Specific aims include enhancing productivity in software and marketing, and upping “operational innovation” in manufacturing.

The company asserted AI was not “just a new technology or a simple tool for improving operations, but rather an innovative technique that triggers fundamental changes in management, actively utilising it as a starting point for discovering new growth momentum”.

To help push the initiative all executives from its companies are set to go through a training camp by the end of 2026, with all 50 CEOs to take the course this month.

It plans to extend the training to eventually cover all employees. Dedicated AI teams are also to be placed across the organisation’s businesses.

The post Samsung goes all-in on AI for internal overhaul appeared first on Mobile World Live.

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Samsung, MediaTek claim 5G uplink industry first  

MediaTek and Samsung completed what they claimed was the first successful test of a 3Tx five-layer uplink configuration, achieving a total uplink throughput of 670 Mb/s in a joint demonstration.

The test combined MediaTek’s M90 5G modem platform with Samsung’s virtualised RAN (vRAN), Massive-MIMO radios, and Macro radios to set “a new standard in 5G uplink performance”.

The trial integrated three transmit antennas (3Tx) across five uplink layers, using a multi-band setup which combined n66 (1.7GHz) as the primary cell and dual n77 (3.7GHz) carriers.

The configuration represents an extension of earlier three transmit antenna work by using five uplink layers to push spectral efficiency and peak upload speeds beyond previously demonstrated benchmarks.

Samsung’s vRAN provided the network backbone for the trial, with the virtualised architecture allowing flexible resource allocation across multiple frequency bands while serving multiple users simultaneously. Massive-MIMO radios handled advanced antenna processing to manage the parallel data streams with reduced interference.

HC Hwang, GM of wireless communication systems and partnerships at MediaTek, stated the validation marks a significant step for the company’s 5G platform as demand for high-resolution cloud applications continues to grow.

Dongwoo Lee, head of technology solution Group at Samsung Networks, stated the results demonstrate speeds capable of meaningfully improving user experience across both consumer and enterprise applications.

The companies explained the achievement strengthens fixed wireless access performance with improved uplink peak speeds.

The companies did not announce a timeline for commercial deployment.

The post Samsung, MediaTek claim 5G uplink industry first   appeared first on Mobile World Live.

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