The Relio R1 HPC+ combines 13th-Gen Intel Core processors, COM-HPC modularity, high-speed I/O, and rugged fanless construction for demanding edge workloads.

© ID 239999757 © Andrii Chagovets | Dreamstime.com and Sealevel

Darveen’s MIC-9X02GLF combines Intel Core processors, GPU-grade PCIe expansion, flexible storage, and wireless connectivity for industrial edge AI and machine vision.

© ID 359926119 © Sudarat Thongpu | Dreamstime.com and Darveen

Ambarella's CV7 targets multi-camera applications like 360-degree cameras.

© Ambarella