❌

Normal view

At 0.8 nanometers, carbon film may replace two layers in future chip wiring

20 August 2026 at 16:40
As transistors inside microchips continue to shrink, the metal wiring that connects them is becoming a growing obstacle to faster, more energy-efficient chips. Narrower wires have greater electrical resistance, while smaller gaps between them increase interference between adjacent signals. These effects impede data transfer and raise energy consumptionβ€”an issue known as an interconnect bottleneck, which is especially acute in data-hungry artificial intelligence processors.

❌