Telechips returned to profitability in the second quarter of 2026, driven by increased sales of in-vehicle infotainment (IVI) chips.
The company said on Aug. 6 that second-quarter revenue rose 33.6% year over year to 59.2 billion won. Operating profit came in at 3.18 billion won. Operating margin improved to 5.4% from negative 8.0% a year earlier.
Growth was primarily driven by the automotive IVI chip business. Increased shipments of products supplied to existing customers supported the company's earnings improvement during the quarter.
Revenue recognition from a system-on-chip (SoC) development contract worth approximately 77.2 billion won, signed in October 2025, also contributed to results. The contract began contributing revenue in the fourth quarter of 2025 and has supported the company's top-line recovery since then. However, the impact was smaller than in the first quarter. A Telechips representative said revenue recognized from the contract exceeded 10 billion won in the first quarter, while the amount recorded in the second quarter was lower.
Net loss narrowed 27.3% from a year earlier to approximately 4.1 billion won. The company said the loss was affected by a decline in the valuation of its stake in Chips&Media, in which Telechips held a 7.25% stake as of the first quarter. Chips&Media's share price fell 31.4% over the 12-month period, declining from around 16,900 won at the end of June 2025 to 11,600 won at the close on June 30, 2026.
"We will continue to improve profitability in the second half by expanding our existing customer base and increasing mass production for new projects," a Telechips representative said.
Participants pose for a commemorative photo during the DB HiTek equipment donation ceremony held in Eumseong, North Chungcheong Province, on Aug. 6. (Photo: DB HiTek)
Participants pose for a commemorative photo during the DB HiTek equipment donation ceremony held in Eumseong, North Chungcheong Province, on Aug. 6. (Photo: DB HiTek)
DB HiTek announced on Aug. 6 that it has transferred semiconductor process equipment to MoaFab, South Korea's national integrated nano-fab platform, as part of efforts to strengthen the country's semiconductor research and development infrastructure.
The company held a semiconductor equipment transfer ceremony at its Sangwoo Campus in Eumseong, North Chungcheong Province, together with the Ministry of Science and ICT and MoaFab. The initiative is aimed at supporting microelectromechanical systems (MEMS) research and development.
MEMS refers to technologies used to manufacture miniature precision mechanical devices at the micro- and nanoscale.
Under the agreement, DB HiTek is donating a total of three pieces of equipment, including one high-temperature thermal processing system and two etching systems.
The equipment will be used by the National NanoFab Center and the Nano Convergence Technology Center for research and development activities as well as prototype production.
In March, DB HiTek signed a memorandum of understanding with the Ministry of Science and ICT, Samsung Electronics, SK hynix and other organizations to strengthen the competitiveness of MoaFab.
MoaFab is a national nano-fabrication support platform established by the Ministry of Science and ICT and the National Nano Infrastructure Council. The platform integrates and manages nano-fabrication equipment and facilities across South Korea to support nanotechnology research, education and prototype development.
Nam Yi-hyun, Chief Executive Officer of FADU. (Photo: THE ELEC)
Nam Yi-hyun, Chief Executive Officer of FADU. (Photo: THE ELEC)
FADU plans to begin supplying samples of its seventh-generation solid-state drive (SSD) controller in 2028, according to a technology roadmap unveiled at FMS 2026.
Nam Yi-hyun, Chief Executive Officer of FADU, disclosed the plan on Aug. 4 during the Future of Memory and Storage (FMS) 2026 conference in Santa Clara, California.
The company did not provide detailed specifications for the seventh-generation controller. However, FADU previously stated in December that it aims to improve SSD performance by more than tenfold compared with the previous generation.
Its long-term target is to achieve random read performance of 100 million input/output operations per second (IOPS) for 512-byte workloads.
At FMS 2026, FADU operated an exhibition booth featuring demonstrations of its sixth-generation SSD controller.
The Gen6 controller, which was recently completed, is scheduled to begin shipments in the second half of this year.
According to the company, the new controller delivers more than twice the performance of its fifth-generation predecessor while helping reduce total cost of ownership (TCO) for data center operators.
FADU is also pursuing a strategy of supplying SSD controllers directly to server customers rather than relying exclusively on memory manufacturers as intermediaries.
The company is seeking to expand its roster of hyperscale customers as part of that effort.
Meta is among FADU's existing hyperscale customers, and the company aims to secure additional large-scale cloud and data center operators as demand for high-performance storage infrastructure continues to grow.
FuriosaAI's Renegade AI processor. (Photo: THE ELEC)
FuriosaAI's Renegade AI processor. (Photo: THE ELEC)
FuriosaAI will supply its neural processing units (NPUs) for a large-scale AI data center project in Sweden, marking a significant expansion of the company's presence in the European AI infrastructure market.
The company announced on Aug. 5 that it is participating in an AI data center development project in Stockholm alongside US AI infrastructure company I/ONX and data center operator Velox.
The facility is planned to reach a total capacity of 15 megawatts and is expected to deploy more than 8,800 units of FuriosaAI's Renegade NPU.
The project will begin with the launch of a 2-megawatt facility early next year, followed by an additional 8 megawatts later in the year. Capacity will eventually expand to 15 megawatts.
FuriosaAI plans to initially supply approximately 1,800 Renegade processors before increasing shipments as the project scales.
The company will provide both Renegade hardware and its accompanying software stack. I/ONX will be responsible for system integration and AI platform services, while Velox will oversee data center development and operations.
According to FuriosaAI, Renegade will operate alongside graphics processing units (GPUs) within the facility. GPUs will be used for AI model training and selected compute workloads, while Renegade processors will handle inference tasks.
The company said the hybrid architecture is designed to improve both performance and power efficiency.
FuriosaAI expects the project to serve as a foundation for expanding AI inference services across Europe.
The company recently established its European subsidiary in Lisbon, Portugal. Through the new operation, FuriosaAI aims to expand its presence in the region's sovereign AI and AI infrastructure markets by promoting its inference-focused computing platform.
Haechitech CEO Choi Sung-min speaks at the company's IPO event held at the CCMM Building in Yeouido, Seoul, on Aug. 5. (Photo: THE ELEC)
Haechitech CEO Choi Sung-min speaks at the company's IPO event held at the CCMM Building in Yeouido, Seoul, on Aug. 5. (Photo: THE ELEC)
Haechitech will begin supplying temperature sensor integrated circuits (ICs) for enterprise solid-state drives (eSSDs) to a major South Korean memory manufacturer this year, marking its entry into a market previously served exclusively by Texas Instruments (TI).
Speaking at the company's initial public offering (IPO) event in Seoul on Aug. 5, CEO Choi Sung-min said Haechitech had secured a supply position for temperature sensor ICs that had previously been supplied solely by TI to the memory company.
"Haechitech's products will be applied to newly launched eSSD products," Choi said.
He added that Haechitech's sensor performance exceeded that of TI's competing products. According to Choi, TI's temperature sensing accuracy is rated at Β±0.4Β°C, while Haechitech's solution achieves Β±0.2Β°C.
Temperature sensor ICs monitor thermal conditions inside eSSDs. Accurate temperature management is critical because heat control directly affects performance, reliability and operating costs in enterprise storage systems.
Despite the design win, Haechitech does not expect temperature sensor ICs to become a major revenue contributor in the near term.
"We significantly lowered pricing to enter as a new supplier," Choi said. "The business is more about expanding our customer portfolio and securing new accounts."
The company expects geomagnetic sensor ICs to remain its primary business.
Choi said revenue from geomagnetic sensors will continue to exceed that of temperature sensor ICs as demand for mid-range and entry-level smartphones grows.
According to the company's securities filing, Haechitech projects temperature sensor IC revenue of approximately 7.9 billion won in 2028, compared with about 24.9 billion won for geomagnetic sensor products.
Geomagnetic sensor ICs detect the Earth's magnetic field and are commonly used in smartphones as electronic compasses. In 2025, geomagnetic sensor sales totaled approximately 9 billion won, accounting for 63.7% of the company's total revenue of roughly 14.1 billion won.
Key customers include Samsung Electronics, OPPO and Vivo. Manufacturing is outsourced to SK keyfoundry.
Haechitech was established in 2017 after being spun off from Magnachip Semiconductor's sensor business division. The company acquired product rights for OPPO and Vivo-related sensor products at the time of the separation.
After generating revenue of 3.9 billion won in 2022, Haechitech recorded an average annual revenue growth rate of 53%, supported by early supply relationships with major electronics companies.
The company plans to list on the KOSDAQ market through the technology-special listing track on Aug. 25.
Haechitech will offer 1 million shares, representing approximately 18.13% of its total outstanding shares after listing. The indicative IPO price range has been set at 23,000 won to 28,000 won per share, with the final offering price scheduled to be determined by Aug. 7. DB Securities is serving as the lead underwriter.
The company forecasts revenue of 23.1 billion won in 2026, rising to 37.3 billion won in 2027 and 54.2 billion won in 2028. It expects to return to annual operating profitability in 2027, with projected operating profit of approximately 4.3 billion won.
DB HiTek reported second-quarter consolidated revenue of 414.5 billion won on Aug. 5, up 23% from a year earlier. Operating profit rose 43% to 105.2 billion won, while operating margin improved by 3 percentage points to 25%.
The results exceeded market expectations. Analysts had forecast revenue of 391.1 billion won and operating profit of 88.6 billion won.
DB HiTek said demand increased for higher-value semiconductor products, particularly automotive and industrial power semiconductors. The company also cited growing demand from AI data centers and robotics applications.
DB GlobalChip, a subsidiary of DB HiTek, contributed to earnings growth by beginning shipments of mobile display driver ICs (DDIs) during the second quarter.
Foundry factory utilization approached 100% during the quarter, reflecting strong customer demand and tight production capacity.
DB HiTek also noted that consolidated revenue could decline going forward following a decision by subsidiary DB World to suspend operations in its ferroalloy business. However, the company said the move is expected to improve profitability, debt ratios and cash flow.
DB World announced on May 29 that it would suspend operations in its ferroalloy division through Sept. 30, citing a prolonged downturn in the steel industry and continued accumulated losses.
The ferroalloy business accounted for 18.7% of DB HiTek's consolidated revenue in 2025. The value of the suspended operations was approximately 40 billion won.
Lisa Su, Chair and Chief Executive Officer of AMD (Photo: AMD)
Lisa Su, Chair and Chief Executive Officer of AMD (Photo: AMD)
AMD reported a 50% year-over-year jump in second-quarter revenue, delivering an earnings beat that exceeded market expectations. The company said it expects growth to continue through the second half of the year as demand across key markets expands.
AMD said on Aug. 4 that it generated revenue of $11.54 billion in the second quarter of 2026. Earnings per share (EPS) came in at $1.66, while gross margin increased by 2 percentage points from a year earlier to 56%.
Analysts surveyed by LSEG had expected revenue of $11.28 billion and EPS of $1.62.
The data center segment, which includes server central processing units (CPUs), generated the highest revenue. Data center revenue reached $6.7 billion, up 107% from a year earlier, driven by strong sales of CPUs and graphics processing units (GPUs).
Revenue from consumer products also increased. Combined client and gaming revenue rose 6% year over year to $3.8 billion in the second quarter. Mobile processor revenue climbed 23% to $3.1 billion during the same period. Gaming revenue, however, fell 31% to $779 million due to lower sales of semi-custom products.
Industrial products also posted gains. Embedded segment revenue reached $977 million, up 19% from a year earlier. AMD said demand remained strong in networking, aerospace, emulation and telecommunications applications, marking the segment's fastest growth rate in three years.
For the third quarter, AMD provided revenue guidance with a midpoint of $13 billion, representing a 41% increase from the same period last year. The forecast exceeds Wall Street expectations of $12.52 billion.
The outlook is largely driven by growth in the server market. AMD projects that the data center AI accelerator market will expand at a compound annual growth rate of more than 45% through 2030, reaching $1.4 trillion. Within that market, server CPUs are expected to grow at more than 50% annually and reach $220 billion by 2030.
The company expects to benefit from rising shipments of products such as its recently unveiled Helios AI infrastructure platform and MI450-series GPUs.
AMD also forecasts server CPU demand to increase by more than 80% in the second half of this year and by more than 70% next year compared with the corresponding prior-year periods. As a result, the company expects data center revenue in 2027 to more than double from the previous year.
Its semiconductor design business is also improving. AMD said it has secured more than $18 billion in new orders. The company expects gaming revenue to remain under pressure with double-digit declines, while growth in consumer products is likely to remain modest.
AMD also emphasized continued strength in memory demand. The company said its Helios platform incorporates more than 50% more High Bandwidth Memory (HBM) than competing products.
"Large AI models benefit from larger memory capacity because it can reduce total cost of ownership," AMD Chair and Chief Executive Officer Lisa Su said.
She added that many customers have been satisfied with the performance gains provided by larger memory configurations, while noting that the company would make adjustments if additional memory proves less beneficial for mid-sized AI models.