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Court Orders SK Chairman Chey Tae-won to Pay 944 Billion Won in Property Division

24 July 2026 at 10:43
SK Group Chairman Chey Tae-won. (Photo: Korea Chamber of Commerce and Industry)
SK Group Chairman Chey Tae-won. (Photo: Korea Chamber of Commerce and Industry)
SK Group Chairman Chey Tae-won. (Photo: Korea Chamber of Commerce and Industry)
SK Group Chairman Chey Tae-won. (Photo: Korea Chamber of Commerce and Industry)

SK Group Chairman Chey Tae-won must pay 944 billion won in property division to Roh Soh-yeong, director of Art Center Nabi, a South Korean court ruled in a remanded divorce case. The ruling included Chey's holdings in SK Inc. as part of the assets subject to division. The amount was about 400 billion won less than the 1.3808 trillion won awarded by the appellate court, but far higher than the 66.5 billion won ordered by the first-instance court.

The Seoul High Court's Family Division 1, presided over by Judge Lee Sang-joo, ruled on July 24 that Chey must pay Roh 944 billion won in property division, along with annual default interest of 5% from the date the judgment becomes final until payment is completed. The court ordered each party to bear its own litigation costs.

The court recognized Chey's holdings in SK Inc. as assets subject to division, concluding that a substantial portion of the couple's joint assets had been formed or acquired during their marriage. It set April 16, 2024, the date when oral arguments concluded in the divorce proceedings, as the valuation date for the assets. SK Inc. shares were trading at around 160,000 won at that time.

The court did, however, take into account the subsequent sharp increase in the value of Chey's SK Inc. shares when determining the amount of the property division. SK Inc. shares that Chey had gifted to relatives to maintain control of the group were excluded from the assets subject to division.

The court recognized Roh's contribution to the formation of the assets at 33.3%, or one-third. It found that Roh contributed to Chey's business activities and to the appreciation of SK Inc. shares by handling household affairs and child-rearing and through her external activities during the marriage. The contribution ratio was slightly lower than the 35% recognized by the appellate court.

The court did not take into account the 30 billion won in slush funds linked to former President Roh Tae-woo in calculating the property division ratio.

For the method of division, the court chose compensatory division, under which Chey will continue to hold the shares and pay Roh the shortfall in her portion in cash. The decision took into account the defense of management control and the stability of the group's governance structure.

The divorce proceedings began in 2015, when Chey publicly disclosed his intention to divorce and the existence of a child born outside the marriage. The legal dispute escalated when he filed for divorce mediation in July 2017.

In December 2022, the first-instance court ruled that Chey's SK Inc. shares were his separate property and excluded them from the assets subject to division, awarding Roh 66.5 billion won in property division and 100 million won in alimony. In May 2024, the appellate court determined that the shares were the couple's joint assets, recognized Roh's contribution at 35%, and ordered Chey to pay 1.3808 trillion won in property division and 2 billion won in alimony.

In October 2025, the Supreme Court found that the 30 billion won from the side of former President Roh Tae-woo appeared to be illicit funds raised during his presidency, and that it could not be taken into account as Roh Soh-yeong's contribution to the formation of the assets even if the money had flowed into SK Group. The court overturned the property division portion and sent the case back to the Seoul High Court. The divorce itself and the 2 billion won alimony payment were confirmed.

The business community is watching the impact the ruling will have on SK Group's governance structure. With Chey required to raise close to 1 trillion won for the property division payment, attention is turning to how he will secure the funds. Some observers have raised the possibility that he could use his SK Inc. stake as collateral or sell some assets, with SK Siltron cited as a prime example.

Immediately after the ruling, Chey's legal counsel issued a statement saying, "The divorce was confirmed by last year's Supreme Court ruling in a process of dissolving a marriage spanning nearly 20 years, and today's remanded ruling on property division followed. We feel apologetic for causing concern to many people." The statement added, "We respect the court's judgment, but we will closely review the details of the ruling before deciding our future response, including whether to appeal to the Supreme Court."

OCI Holdings Posts 108 Billion Won Operating Profit in Second Quarter

24 July 2026 at 10:42
(Photo: OCI Holdings)
(Photo: OCI Holdings)

OCI Holdings posted its third consecutive quarter of operating profit, as its Malaysian solar-grade polysilicon subsidiary and Vietnamese wafer subsidiary sold out their currently available production through long-term supply agreements (LTAs).

The company reported second-quarter revenue of 1.0231 trillion won and operating profit of 108 billion won on July 23. Revenue rose 31.8% from a year earlier, while the company returned to an operating profit. The latest results mark its third straight quarter of operating profitability since the fourth quarter of 2025.

OCI TerraSus, OCI Holdings' Malaysia-based polysilicon manufacturing subsidiary, recently signed a long-term agreement with a new US customer for solar-grade polysilicon, fully committing its annual production capacity of 35,000 metric tons. To meet growing solar demand driven by the expansion of AI infrastructure in the US, the company plans to add another 35,000 tons of annual capacity, bringing total production capacity to 70,000 tons by 2029.

Its Vietnam-based wafer subsidiary, NEOSILICON Technologies, has also secured contracts covering its planned 11.5-gigawatt (GW) production capacity through 2029. The company currently operates a 2.7GW production line and has begun supplying products. Shipments to a new US customer are scheduled to begin next year.

OCI Holdings said it has established a non-China (Non-PFE) solar supply chain through its Malaysian polysilicon and Vietnamese wafer operations to respond to changes in US trade policy. The company expects deliveries under newly signed contracts to accelerate once uncertainty surrounding Section 232 of the US Trade Expansion Act is resolved.

The company is also expanding its US solar power generation business. OCI Energy recently generated returns by selling the 500-megawatt (MW) La Salle project. It is also negotiating a power purchase agreement (PPA) with a major US technology company for another project targeted to begin construction by the end of this year. OCI Energy is currently developing 29 projects centered in Texas with a combined capacity of 6.5GW, including 3.4GW of solar generation and 3.1GW of energy storage systems (ESS).

"The expansion of AI data centers is driving higher electricity demand in the US, further strengthening growth momentum in the solar market," said Lee Woo-hyun, chairman of OCI Holdings. "We will expand investment across the solar value chain based on our differentiated Non-PFE competitiveness while proactively responding to changes in the global supply chain."

TEMC CNS Resumes SK hynix Semiconductor Materials Shipments After Fire Recovery

24 July 2026 at 10:42
A forklift loads TiClβ‚„ onto a delivery truck at TEMC CNS's Boeun Plant 2 in North Chungcheong Province on July 23. (Photo: THE ELEC)
A forklift loads TiClβ‚„ onto a delivery truck at TEMC CNS's Boeun Plant 2 in North Chungcheong Province on July 23. (Photo: THE ELEC)
A forklift loads TiClβ‚„ onto a delivery truck at TEMC CNS's Boeun Plant 2 in North Chungcheong Province on July 23. (Photo: THE ELEC)
A forklift loads TiClβ‚„ onto a delivery truck at TEMC CNS's Boeun Plant 2 in North Chungcheong Province on July 23. (Photo: THE ELEC)

TEMC CNS has resumed shipments of titanium tetrachloride (TiClβ‚„), a semiconductor precursor used in thin-film deposition, to SK hynix, about 10 months after a fire halted production at its Anseong plant. The company has officially declared a return to normal operations with the first commercial shipment from its new production base in Boeun, North Chungcheong Province.

TEMC CNS held a ceremony on July 23 to mark the first commercial shipment of TiClβ‚„ from its Boeun Plant 2. About 40 employees, including CEO Lee Dong-jun, Ko Sung-jong, head of Manufacturing Technology, and Koo Ja-kwon, director of Manufacturing Technology, attended the event, which featured a ribbon-cutting ceremony and the departure of the first delivery truck. The products shipped that day will be supplied to SK hynix's D램 production lines.

"Following the fire at our Anseong plant in September 2025, we have established a new production system and resumed supplying products to our customer," Lee said. "This marks a meaningful new beginning for the company's growth, built on our new manufacturing foundation."

Ko said, "When the fire occurred in 2025, the future looked uncertain, but every employee came together to make this resumption possible. It is a meaningful moment that demonstrates the company's resilience in overcoming adversity."

TEMC CNS executives and employees, including CEO Lee Dong-jun, Manufacturing Technology Head Ko Sung-jong and Manufacturing Technology Director Koo Ja-kwon. (Photo: THE ELEC)
TEMC CNS executives and employees, including CEO Lee Dong-jun, Manufacturing Technology Head Ko Sung-jong and Manufacturing Technology Director Koo Ja-kwon. (Photo: THE ELEC)

TEMC CNS completed installation of TiClβ‚„ production equipment and obtained regulatory approvals for Boeun Plant 2 in December 2025. It began trial operations in January and spent approximately six months completing customer qualification and production line validation. Sample shipments began in June, while the first commercial shipment on July 23 marked the start of full-scale production.

The company plans to restore TiClβ‚„ shipments to pre-fire levels by the end of this year. Before the fire, TEMC CNS supplied approximately 10 billion won worth of TiClβ‚„ annually to SK hynix. Demand for TiClβ‚„ and other semiconductor precursors is expected to increase as SK hynix ramps up new D램 production lines, including M15X in Cheongju and the first fab at its Yongin semiconductor cluster. Additional demand exceeding previous supply volumes is expected beginning next year.

TEMC CNS has also restored production of hexachlorodisilane (HCDS), another precursor whose production was halted by the same fire, after relocating the production line to Boeun Plant 2. Shipments to overseas customers, including those in China, began in May, while major customers are currently conducting final production line qualification. The company expects to complete the evaluation process and resume mass production of HCDS later this year.

TEMC CNS executives participate in a ribbon-cutting ceremony to commemorate the first commercial shipment of TiClβ‚„. (Photo: THE ELEC)
TEMC CNS executives participate in a ribbon-cutting ceremony to commemorate the first commercial shipment of TiClβ‚„. (Photo: THE ELEC)

The resumption of production came about two months earlier than initially expected after the company accelerated consolidation of manufacturing operations at its Boeun facility. Prior to the fire, TEMC CNS had planned to relocate precursor production from Anseong to Boeun Plant 2 by the second half of 2027 to improve manufacturing efficiency and prepare for customers' new production lines. Boeun Plant 2 had previously manufactured products including bis(diethylamino)silane (BDEAS) and disilane (Siβ‚‚H₆).

Following the fire, the company converted its long-term investment plan into an accelerated production recovery project by establishing new TiClβ‚„ and HCDS production lines at Boeun. It also relocated its headquarters from Anseong to Boeun in March, completing consolidation of its manufacturing base. The damaged Anseong Plant 1 is now being considered for future new business operations.

The relocation has nearly doubled the company's TiClβ‚„ production capacity compared with its previous facility. The new production line incorporates smart factory technologies, automating purification and filling processes while introducing real-time production data management to improve manufacturing efficiency and product consistency. The proximity of parent company TEMC's manufacturing facilities is also expected to generate logistics synergies.

A fire on September 6, 2025, destroyed the TiClβ‚„ and HCDS production facilities at TEMC CNS's Anseong Plant 1 in Gyeonggi Province. Because the finished goods warehouse was not damaged, the company continued supplying customers through November 2025 using approximately two months of inventory. During the subsequent supply interruption, Merck and Soulbrain, which were already approved suppliers to the same customers, filled the supply gap.

TiClβ‚„ is a precursor used to form titanium nitride (TiN) thin films during semiconductor deposition processes. A precursor is a chemical material used before a reaction takes place. TiN is used in D램 capacitor electrodes and as a protective barrier for metal interconnects, reducing leakage current and preventing copper diffusion into surrounding dielectric layers to improve semiconductor reliability.

HCDS is a precursor used to deposit silicon nitride (SiN) and silicon oxide (SiO) films. These materials are widely used as insulating and protective layers in D램 and NAND flash devices.

Samsung Electro-Mechanics Signs 300 Billion Won MLCC Supply Deal for AI Servers

23 July 2026 at 14:12
Samsung Electro-Mechanics plant in Busan. (Photo = THE ELEC)
Samsung Electro-Mechanics plant in Busan. (Photo = THE ELEC)
Samsung Electro-Mechanics plant in Busan. (Photo = THE ELEC)

Samsung Electro-Mechanics has signed a multilayer ceramic capacitor (MLCC) supply agreement worth approximately 300 billion won with a major global company for artificial intelligence (AI) servers. To date, the company has secured cumulative long-term agreements (LTAs) worth about 2.3 trillion won in this segment.

Samsung Electro-Mechanics announced on July 23, 2026, that it signed a supply contract valued at approximately 295.1 billion won with a major global client. The contract value accounts for 2.6% of the company’s consolidated revenue from last year. The contract period runs for one year, from Jan. 1, 2027, to Dec. 31, 2027. The client's identity was not disclosed due to confidentiality terms.

Under the agreement, Samsung Electro-Mechanics will supply high-performance MLCCs for AI servers and data center systems. The company stated that the deal reflects market recognition of its MLCC design capabilities, high reliability under extreme temperature and voltage conditions, and robust production quality management.

Samsung Electro-Mechanics has been steadily expanding LTAs with global clients, focusing on components for AI servers. In May, the company signed an LTA worth about 1.5 trillion won for silicon capacitors (Si-Cap). In June, it secured another AI server MLCC supply contract worth approximately 450 billion won with a global cloud service provider (CSP).

Industry analysts note that securing consecutive, large-scale long-term MLCC supply contracts is unusual, as MLCCs are increasingly viewed as strategic components determining the stability and performance of AI infrastructure.

Samsung Electro-Mechanics currently holds more than 40% of the global AI server MLCC market, sharing the lead with Japan's Murata Manufacturing. The company is actively discussing mid- to long-term supply plans with multiple global customers to secure stable demand and accelerate its portfolio shift toward high-value-added products.

AI server MLCCs are high-value components requiring up to ten times the volume of general servers, with as many as 600,000 units installed per server rack. They must deliver ultra-small form factors, high capacity, and operational stability in high-temperature and high-voltage environments, presenting high technical entry barriers.

"Based on customer trust, we will lead the AI component market by developing next-generation advanced products and building a stable supply system," said Chang Duck-hyun, CEO of Samsung Electro-Mechanics.

SK Hynix Accelerates Cheongju P&T7 Project, Reapproves 7.1 Trillion Won Investment

22 July 2026 at 23:42
Rendering of SK hynix's P&T7 facility in Cheongju. (Source: SK hynix)
Rendering of SK hynix's P&T7 facility in Cheongju. (Source: SK hynix)
Rendering of SK hynix's P&T7 facility in Cheongju. (Source: SK hynix)
Rendering of SK hynix's P&T7 facility in Cheongju. (Source: SK hynix)

SK hynix is accelerating investment in its P&T7 advanced packaging facility in Cheongju by bringing forward the project's execution schedule. The company has increased the amount approved by its board of directors to support an earlier cleanroom rollout, although the total planned investment for the project remains unchanged.

SK hynix announced on July 22 that its board approved an approximately 7.09 trillion won facility investment for construction of the P&T7 plant. The investment represents 5.88% of the company's equity. In its regulatory filing, SK hynix said the investment is intended to "secure production capacity in Cheongju to meet growing global demand for AI memory." The investment period extends through December 31, 2032.

The revised approval reflects the company's decision to accelerate the opening of cleanroom space in response to rising demand. Rather than increasing the overall project budget, SK hynix is adjusting the timing of capital expenditures under its existing investment plan. "The total investment for P&T7 remains unchanged at approximately 19 trillion won," the company said. "As the investment schedule has been brought forward, the amount requiring board approval increased, making a new board resolution necessary."

P&T7 will be SK hynix's seventh packaging and test facility and will manufacture advanced packaging products for AI memory, including high-bandwidth memory (HBM). Construction of the plant began in April. The company plans to begin installing the wafer test (WT) line in October 2027, followed by the phased construction of wafer-level packaging (WLP) lines through February 2028.

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