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Normal view

Received — 9 August 2026 ⏭

Electronic Design
MRDIMMs: Memory for AI Data Centers 4 August 2026 at 19:30

MRDIMMs: Memory for AI Data Centers

Electronic Design

By: bwong@endeavorb2b.com (William G. Wong)

4 August 2026 at 19:30

MRDIMMs provide higher capacity and performance to meet the demands of AI data centers.

Electronic Design
Serial EEPROM Delivers Long-Term Embedded Storage 31 July 2026 at 14:57

Serial EEPROM Delivers Long-Term Embedded Storage

Electronic Design

By: (undefined)

31 July 2026 at 14:57

GigaDevice’s GD24CL serial EEPROM supports 4 million program/erase cycles.

Electronic Design
FMS Then and Now: Memory and Storage Insights 30 July 2026 at 19:15

FMS Then and Now: Memory and Storage Insights

Electronic Design

By: bwong@endeavorb2b.com (William G. Wong)

30 July 2026 at 19:15

Jim Handy and Bill Wong discuss the Future Memory and Storage conference.

Electronic Design
Future of Memory and Storage Conference 2026 30 July 2026 at 17:51

Future of Memory and Storage Conference 2026

Electronic Design

By: bwong@endeavorb2b.com (William G. Wong)

30 July 2026 at 17:51

See what’s going on at FMS 2026.

Future of Memory and Storage Conference

Electronic Design
NOR Flash Handles Secure, ASIL D Automotive Apps 30 July 2026 at 17:45

NOR Flash Handles Secure, ASIL D Automotive Apps

Electronic Design

By: (undefined)

30 July 2026 at 17:45

ArmorFlash MX78 developed by Macronix addresses cybersecurity and automotive rugged requirements.

Received — 16 July 2026 ⏭

Electronic Design
AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC 9 July 2026 at 21:30

AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC

Electronic Design

By: (undefined)

9 July 2026 at 21:30

The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.