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Prototype device polarizes light with heat for denser optical signals

23 July 2026 at 20:40
Researchers have found a way to speed up components that control light polarization in optical communication and computing. Polarization is a property of light that can carry additional information along with the primary signal, enabling higher data throughput. State-of-the-art components that control polarization in optical circuits have to be physically rotated many times a second, wasting precious time. Instead, this can be achieved by varying the temperature of the material the light passes through.

Artificial synapse uses light-color programming for brain-like balanced learning

19 June 2026 at 17:20
The human brain actively keeps "learning" in balance by holding on to what matters and letting go of what does not. Researchers in Korea have now reproduced this ability in a semiconductor device, using the color of light to strengthen (remember) or weaken (forget) an artificial synapse's memory. Remarkably, the key ingredient is a material "defect" that engineers usually try to eliminate. The study appears in Nature Communications.

AI model extracts hidden semiconductor properties from simple transistor tests in under 1 millisecond

18 June 2026 at 20:20
A tandem neural network capable of inferring key physical parameters of semiconductor materials from simple transistor measurements has been developed, as reported by researchers from the Institute of Science, Tokyo. While conventional approaches for this type of analysis require hours or even days, the proposed system produces results in under 1 millisecond with near-perfect accuracy.

Atom-thin coating tackles key bottleneck in chip miniaturization

17 June 2026 at 13:40
The global semiconductor market is approaching US$1 trillion in annual sales, driven by growing demand for faster computers, smarter AI systems and more powerful electronic devices. Singapore, which produces one in 10 of the world's chips, has a direct stake in sustaining that trajectory.

Liquid cooling technology for semiconductor chips is 10 times more efficient than previous record

15 June 2026 at 23:30
AI data centers are power-hungry. Not only do artificial intelligence computations consume enormous amounts of electricity, but a significant amount of energy is also required to cool the semiconductor chips that heat up during operation. As AI chips continue to deliver higher performance, the amount of heat they generate increases rapidly. As a result, conventional air cooling and external copper heat spreaders are approaching their practical limits. To address this challenge, a KAIST research team has developed an ultra-high-efficiency liquid-cooling technology that cools semiconductor chips from within.

Nanoengineered wood sets new record for transformer insulation

15 June 2026 at 16:40
The world's power grid is straining under the surge in electricity demand from data centers, electric vehicles and renewable energy. And a century-old technology, the power transformer, must support this dramatic increase. A particularly weak link in this is the potential for insulation breakdown, the most frequent indicator of power transformer failures.

Transparent OLED advance could improve AR displays and smart windows

12 June 2026 at 18:20
Seoul National University College of Engineering announced that a research team led by Prof. Yongtaek Hong from the Department of Electrical and Computer Engineering has developed a high-performance transparent organic light-emitting diode (OLED) incorporating highly conductive transparent metal mesh top electrodes fabricated using a selective metal deposition technique. The research was published in the journal Materials Horizons and was selected as the outside front cover image for the issue.

Copper thin films reveal ballistic electron transport that could reshape future chip wiring

12 June 2026 at 17:40
A joint research team has experimentally observed ballistic transport in single-crystalline copper thin films, demonstrating that ballistic transport is achievable in an industry-standard metal at interconnect-relevant dimensions. The study, titled "Ballistic transport in nanodevices based on single-crystalline Cu thin films," was published in Nature Communications.

Buying a laptop may soon come with instant carbon data, thanks to new AI agents

12 June 2026 at 11:40
If you shop on Google Flights, you get a quick comparison of different itineraries: One flight's carbon emissions may be average, while another's are 14% higher. But if you go shopping for a new laptop, you likely won't find quick, comprehensible information on different models' sustainability bona fides, despite the notable environmental impacts of producing and discarding electronics. In part, that's because understanding a device's emissions is difficult and time-consuming, even for experts.

Monolayer WSeβ‚‚ unlocks high-performance p-type transistors that could change how future chips balance speed and power

9 June 2026 at 17:07
Transistors, small devices that can amplify or switch electrical signals, are central components of all modern computer chips and digital devices. There are two main types of transistors, known as n-type and p-type transistors.

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