COXEM, a scanning electron microscope (SEM) specialist, is transforming itself into a maker of nondestructive inspection equipment for advanced semiconductor packaging. The company has begun supplying modules for high-bandwidth memory (HBM) analysis and plans to introduce automated inspection equipment for panel-level packaging (PLP) and glass substrates.

"The ion beam polisher, which precisely polishes semiconductor cross sections, was developed into equipment in collaboration with a domestic equipment company," COXEM CEO Lee Jun-hee said in a recent interview at the company's headquarters in Daejeon. "It has already been supplied to major semiconductor manufacturers and is undergoing mass-production evaluations."

COXEM, founded in 2007, is a South Korean developer and manufacturer of SEMs. The company started by licensing technology from the Korea Research Institute of Standards and Science (KRISS). It localized compact tabletop SEMs in the early 2010s and ranked fifth globally in sales in 2022, establishing its competitiveness in the market.

Lee, who holds a doctorate in electrical and electronic engineering from the Korea Advanced Institute of Science and Technology (KAIST), joined COXEM as head of its research center in 2010 and led research and development (R&D) of the technology. Lee was recognized for his technology development capabilities and business planning skills in 2012.

Ion Beam Polisher Module for HBM, MLCC Targets Qualification Early Next Year

An ion beam polisher is preprocessing equipment used to etch and polish a sample before it is examined with an electron microscope. It is based on ion miller commercialization technology that COXEM completed in 2019. COXEM's ion gun module, which emits an argon (Ar) ion beam, is installed inside the equipment. A separate SEM is also installed to observe and analyze the sample after preprocessing. AP Systems handles assembly and sales of the complete equipment.

Semiconductor analysis laboratories have traditionally polished sample cross sections manually, mainly using blades or sandpaper. The ion beam polisher automates the process. It uses a nanometer-scale particle beam to create flat cross sections without errors. It also minimizes sample damage and contamination compared with chemical mechanical polishing (CMP), preserving the sample's fine structures.

The system is similar to focused ion beam-scanning electron microscope (FIB-SEM) systems from global competitors such as Thermo Fisher Scientific and ZEISS, but differs in processing area and speed. FIB-SEM can precisely process extremely small areas of several micrometers or less and is suited to detailed analysis of nanoscale defects.

The ion beam polisher can rapidly remove material across areas as wide as several millimeters at a rate of 1,000 micrometers per hour. It can be used to inspect structures and defects including through-silicon vias (TSVs) and microbumps in HBM, as well as internal layers of multilayer ceramic capacitors (MLCCs). It is also less expensive. COXEM's CP-SEM lineup combining an ion miller and SEM costs about one-tenth as much as competing FIB-SEM systems.

"We initially guaranteed 100 hours of durability for the ion gun module, but have increased that to several thousand hours to meet the requirements of actual semiconductor mass-production lines," Lee said. "We expect to pass customer qualification tests around the end of this year or early next year and move into mass-production supply."

Nondestructive Inspection Equipment for Large Substrates Under Development

COXEM is also preparing semiconductor inspection equipment under its Eirtron brand. The equipment is designed for nondestructive observation of large-area samples, including wafers, large panels and glass substrates, during manufacturing. It is based on atmospheric-pressure scanning electron microscope (A-SEM) technology developed by COXEM.

Conventional inspection of large substrates requires cutting cross sections and moving them to an analysis laboratory. This is because conventional SEMs used for inspection rely on sealed high-vacuum chambers, limiting sample size. SEMs inspect samples by analyzing signals reflected from an irradiated electron beam. If the beam collides with air particles and scatters, the signal weakens and the detected image becomes blurred. High-vacuum chambers are used to prevent this.

A-SEM addresses this issue while maintaining high-resolution imaging with 30-nanometer resolution. This is achieved by completely separating the electron column, including the electron gun that emits the beam, from the external environment using a graphene membrane.

Graphene has high electron transmittance, allowing the beam to pass while blocking outside air. A multi-window structure allows it to withstand pressure of one atmosphere. The graphene membrane and signal detector are positioned as close as possible to the sample, while helium gas is injected to minimize electron-beam scattering and signal loss. These are all proprietary technologies patented by COXEM.

A-SEM can observe samples in ambient air at atmospheric pressure, eliminating size restrictions. It also removes the need for complex preprocessing steps such as evacuating a vacuum chamber or cutting samples, helping reduce process time.

"A-SEM technology enables real-time observation and analysis on production lines without damaging samples, making it an innovation that could shift the paradigm of semiconductor inspection processes," Lee said. "By commercializing automated A-SEM equipment, we aim to take the lead in the semiconductor equipment market currently dominated by overseas companies such as Applied Materials and Hitachi."

A test model of COXEM's automated equipment is currently undergoing validation by a major South Korean substrate company. The company plans to expand its target customer base to outsourced semiconductor assembly and test (OSAT) companies.

YMC, a maker of components and materials for semiconductor and display equipment, plans to distribute at least 15 billion won in dividends to shareholders over three years starting this year.

YMC disclosed the shareholder value enhancement plan on Sept. 16. The company updated a plan announced in April, setting numerical targets for shareholder returns.

YMC will use 30% of net income as a source for dividends. It also set a minimum dividend level. The company plans to pay at least 5 billion won annually from this year through 2028, for a cumulative total of at least 15 billion won over the three years.

The company will also continue to cancel treasury shares. YMC canceled 500,000 treasury shares in March and plans to cancel at least another 630,569 shares by year-end, equivalent to about 50% of the 1,261,138 shares it currently holds. If completed as planned, the total number of shares outstanding will decline by at least 3.32%. Including shares canceled in February 2023, cumulative cancellations are expected to exceed 1.63 million shares.

YMC has also established a system to monitor implementation of its shareholder value enhancement plan. The company will carry out the plan under the management and supervision of its board and conduct a self-assessment at least once a year, disclosing its implementation status. It also plans to expand investor communications through domestic and overseas investor relations events and press releases.

"The shareholder value enhancement plan demonstrates our strong confidence in improving the company's future performance and our commitment to shareholder returns," YMC said. The company posted consolidated revenue of 100.5 billion won and operating profit of 3.89 billion won in the first half of 2026, up 19.2% and 55.3%, respectively, from a year earlier. A new semiconductor plant in Dangjin, South Chungcheong Province, completed last year, began full-scale mass production this year, driving revenue growth and improved profitability.

YMC manufactures and supplies diffusers and susceptors for chemical vapor deposition (CVD) equipment as well as vacuum equipment components. Diffusers uniformly distribute gas inside process equipment chambers to help form even thin films on treated surfaces or facilitate etching. Susceptors support wafers or substrates to maintain uniform temperatures during thin-film deposition.

Samsung Electronics plans to outsource all additional production of conventional memory modules as it focuses its in-house capacity on high-value memory products such as high-bandwidth memory (HBM).

Samsung Electronics is strongly urging outsourced semiconductor assembly and test (OSAT) partners to expand production lines to meet growing demand for conventional memory modules, according to industry sources on Sept. 15. Instead of expanding its own production capacity for DDR5 memory modules and solid-state drives (SSDs) used in PCs, servers and laptops, the company is increasing allocations to outsourcing partners.

“Samsung Electronics lacks space to expand existing back-end production lines needed to manufacture semiconductors for artificial intelligence (AI), so it is reallocating space and equipment at packaging plants in Cheonan and Onyang to advanced packaging lines, including HBM,” a person familiar with the matter said. “The company has decided to handle most increases in conventional memory module production through outsourcing rather than expanding its own capacity.”

Another person familiar with the matter said, “Samsung Electronics has asked its partners since June last year to increase investment in production lines for conventional DDR5 memory modules and SSDs. This year, it has even proposed that partners bring forward capacity expansions from their existing plans.”

Samsung Electronics is expanding outsourcing of conventional modules because it needs to use its limited production facilities more efficiently. The company plans to begin construction this month of a new 6 trillion won HBM plant at its Onyang campus, but completion will take several years.

A new $1.5 billion back-end processing plant under construction in an industrial park in Thai Nguyen Province in northern Vietnam will also be dedicated to testing older memory products, including DDR4, low-power LPDDR4, NAND flash and universal flash storage (UFS) products. That leaves Samsung Electronics with limited in-house facilities available to increase conventional module production.

DDR5 memory modules are assembled by mounting prepackaged DRAM and NAND chips and passive components onto printed circuit boards (PCBs) using surface-mount technology (SMT). The process is relatively less complex than advanced packaging for products such as HBM, allowing outsourcing partners to expand production capacity sufficiently.

Hanyang Digitech, SFA Semicon and Dreamtech Expand Facilities

Samsung Electronics’ outsourcing partners are also expanding production facilities in line with the company’s increased outsourcing of memory modules.

Dreamtech, which began mass production of DDR5 modules in India in November last year, is also expanding its production lines. In June, the company approved equipment investment to convert and expand its Noida Plant 1 in India, which had assembled printed board assemblies (PBAs) for smartphones, into a large-scale memory module production line. The expansion work will be completed this month, followed by a gradual increase in production capacity. The plant is ultimately expected to secure annual production capacity of more than 50 million units.

Hanyang Digitech is working to improve productivity at its existing memory module plant in Vietnam. The company invested more than 31.5 billion won in the first half of this year to introduce new machinery and automate production processes.

SFA Semicon is transferring DDR5 testing and module assembly equipment previously used at Samsung Electronics’ Onyang campus to SFA Semicon’s plant in the Philippines. The first phase is scheduled to begin operations in November, followed by the second phase in the second quarter of next year. The move is expected to significantly increase DDR5 final testing and module production capacity. SFA Semicon handles fine-pitch ball grid array (FBGA) packaging of memory chips at its Cheonan plant in South Chungcheong Province and conducts final testing and module assembly at its Philippine plant.

Qualcomm has signed a second agreement with a large-scale data center operator, or hyperscaler, to jointly design and produce artificial intelligence (AI) accelerators. The deal marks tangible progress in AI for Qualcomm, which has historically relied on smartphone chips for most of its revenue.

Akash Palkhiwala, Qualcomm’s chief financial officer (CFO), said at the Goldman Sachs Technology Conference 2026 on Sept. 8 that the company is working with another global hyperscaler in addition to Amazon. He said the custom silicon Qualcomm is developing with hyperscalers is intended not for auxiliary workloads but as primary AI accelerators in data centers.

The remarks indicate that Qualcomm is developing AI accelerators optimized for the customer’s data centers and services. Palkhiwala did not identify the hyperscaler. Major hyperscalers include Amazon Web Services (AWS), Microsoft, Google, Meta, Oracle and IBM. Qualcomm is already working with Amazon and Meta.

The agreement with the undisclosed hyperscaler is expected to be similar in structure to Qualcomm’s Amazon deal. Qualcomm and Amazon recently announced a collaboration on customized silicon for data center AI acceleration and high-performance optical connectivity solutions.

Qualcomm will supply the products to Amazon over the next 10 years. The agreement is valued at a total of $60 billion, or about 80.514 trillion won. Amazon will also receive warrants that vest in proportion to its purchases. The structure is intended to strengthen and extend the companies’ long-term partnership. Qualcomm has begun chip production, while Amazon has secured 15% of the warrants.

“The Amazon agreement is very large, but it is only the beginning,” Palkhiwala said. He added that Qualcomm’s technology collaboration with another hyperscaler is taking a similar form and is making strong progress.

Qualcomm has also agreed to supply data center central processing units (CPUs) to Meta. Its Dragonfly C1000 is planned for Meta’s next-generation server fleet. Dragonfly is Qualcomm’s data center product portfolio. Qualcomm is targeting more than twice the performance per watt of existing competing server CPUs with the C1000. A server fleet refers to a group of servers operating together to perform the same function.

Qualcomm expects its agreements with Amazon, Meta and the undisclosed hyperscaler to help push data center product revenue above 20 trillion won in three years. “We have already made significant progress toward our fiscal 2029 target of $15 billion, or about 20.07 trillion won,” Palkhiwala said. “We are at a point where we don’t need that many additional business elements.”

Qualcomm has recently been focusing its experience in advanced-node chip design and high-volume manufacturing on its custom silicon business. It is also developing Dragonfly commercial AI accelerators that are not customized for individual customers: the AI250 and AI300. The AI250 is scheduled for mid-2027, followed by the AI300 in 2028. Both products will incorporate Qualcomm High Bandwidth Compute (HBC) memory technology.

SK hynix plans to save a cumulative 600 million tons of water at its Korean operations by 2030.

The company said it is presenting its water conservation achievements and targets at Korea International Water Week 2026, held at EXCO in Daegu from Sept. 9 to 11. Its exhibition booth highlights major water conservation, recycling and ecosystem preservation activities through videos and graphics.

SK hynix has operated a water and wastewater reduction task force since 2018, reducing water consumption and expanding reuse in semiconductor manufacturing. As a result, its Korean operations saved an average 170,000 tons of water per day last year, equivalent to the daily household water consumption of about 550,000 people.

Cumulative water savings reached 303.37 million tons by the end of last year, exceeding the company’s target of 264 million tons. SK hynix aims to increase the total to 329 million tons this year. Water reuse rose about 54% to 73.59 million tons last year from 47.88 million tons in 2022.

SK hynix’s Icheon site produces 94,400 tons of recycled water per day through its wastewater reuse facilities. The recycled water is supplied to facilities including air pollution control systems. Its Cheongju site became the first in Korea’s semiconductor industry to introduce externally treated reclaimed wastewater in 2023, recycling it for industrial use.

The company is also strengthening water management across the entire cycle from intake and use to recycling and discharge. Its wastewater treatment processes include ozone oxidation, activated carbon and multistage coagulation and sedimentation systems. SK hynix continues to develop and invest in additional technologies to reduce pollutants.

SK hynix also carries out activities to monitor local communities and ecosystems. It operates the ECOSEE citizen science program around Anseong Stream to track ecological changes before and after development of the Yongin semiconductor cluster. Citizens participate directly in surveys of plants, birds and aquatic organisms and in collecting data.

“We will continue to advance our water management system to use less water, which is essential to semiconductor production, and reuse as much of it as possible,” SK hynix said. “We will also steadily expand investments in process improvements and related technologies and facilities.”

Startup Zeta Mobility is expanding its 4D radar artificial intelligence sensor-fusion technology, originally developed for autonomous driving, into senior care and healthcare. The company plans to produce tangible results this year through partnerships with a company and a university.

“We signed memorandums of understanding with two companies and institutions last month and began proof-of-concept testing,” Zeta Mobility Vice President Kim Sang-ki said on Sept. 9. The partners are senior care technology company Dolbomdream and Gachon University’s Intelligent Homecare Integrated Support Infrastructure Project Group, or AAL Center. Zeta Mobility aims to commercialize services for vulnerable populations using its technology.

Zeta Mobility is a deep-tech startup developing high-resolution 4D imaging radar and AI sensor-fusion technologies. The company was founded in February 2024 as a startup spun out of a laboratory at KAIST’s Graduate School of Mobility and joined the university’s startup incubator. In October that year, it was selected for the Ministry of SMEs and Startups’ Deep Tech TIPS program and Samsung Electronics’ C-Lab Outside startup support program. It was also selected for the ministry’s Super Gap Startup 1000+ program in April last year and received an award from the head of the Small and Medium Business Administration in May.

Radar emits electromagnetic waves, or millimeter waves, and analyzes reflected signals. Unlike conventional 3D radar, which measures distance, direction and speed, 4D imaging radar also captures height data. This allows scattered radar reflections to be converted into high-resolution three-dimensional point-cloud data.

Raw 4D radar data contains signal noise that makes it difficult to interpret. Zeta Mobility addresses this with its proprietary AI algorithm software, Zeta AI Engine. The software removes meaningless reflections and signal noise and extracts the shape of objects. By analyzing continuous time-series data, it can infer human movement, changes in posture and biometric signals such as heart and respiratory rates with more than 90% accuracy.

Zeta Mobility has integrated the technologies into three versions of its ARGUS platform, an intelligent system that detects, understands and transmits radar sensor data. The platform takes the form of a compact, low-power, high-efficiency board for edge AI, which runs AI models directly on devices where data is generated.

ARGUS-A is designed to detect safety conditions and driving environments for autonomous vehicles. ARGUS-C monitors vehicle occupants in real time. ARGUS-H is an indoor care product designed to detect falls among elderly people living alone and monitor biometric signals.

Zeta Mobility initially focused on autonomous driving and in-cabin occupant-detection sensors. But as commercialization and market adoption of autonomous driving progressed more slowly than expected, the company strategically shifted its business focus toward senior healthcare. Its 4D radar AI and sensor-fusion technologies can be applied to indoor residential spaces as well as vehicle interiors.

Partnerships With Dolbomdream, Gachon University to Test ARGUS-H

Zeta Mobility has secured infrastructure to test ARGUS-H through the two recently signed MOUs.

The company will first work with Dolbomdream on joint testing and commercialization of senior care and monitoring services. The companies plan to combine Zeta Mobility’s radar AI sensor technology with Dolbomdream’s wearable sensor-based healthcare technology and jointly pursue government projects and research and development programs. They also plan to expand their collaboration into worker safety management at industrial sites.

Existing senior-care technologies face trade-offs between accuracy, convenience and privacy. Falls among elderly people living alone frequently occur in private spaces such as bathrooms, toilets and bedrooms, where cameras face strong user resistance as well as ethical and legal constraints. Smartwatches and patch-type biosensors require users to wear them continuously and recharge them regularly. Elderly users may forget to wear the devices or take them off, creating monitoring gaps and potentially delaying responses to emergencies such as falls.

Zeta Mobility says its 4D radar AI technology can address those problems. ARGUS-H can be installed on a wall or ceiling to monitor an entire space without requiring the user to wear a device. Because it analyzes radar waveforms rather than visual images, it avoids capturing private visual information. It can also detect a person’s precise location and subtle movements in low-light or steam-filled environments where visibility is poor.

Zeta Mobility will work with Gachon University’s AAL Center to develop and commercialize intelligent homecare services for vulnerable populations. The center has researched a big-data platform for elderly people’s activities of daily living. Zeta Mobility plans to combine the university’s software and data research capabilities with its own technology to build infrastructure for real-time monitoring of elderly users.

The partners will also develop and deploy AI care equipment and personalized service models. They plan to support healthcare programs for elderly people run by local governments and community welfare organizations, while expanding into the senior healthcare and smart-home markets.

“We will use these recent demonstration agreements as a stepping stone to establish technical standards for smart-home senior care and secure our first supply contract with a construction company or healthcare platform within this year,” Kim said.

Intekplus will supply about 6 billion won worth of semiconductor and substrate inspection equipment overseas.

Intekplus said in a regulatory filing on Sept. 9 that it signed a contract with ACCUTECH to supply semiconductor and substrate inspection equipment. ACCUTECH is a semiconductor equipment distributor based in Shenzhen, China.

The contract is valued at about 6.08 billion won, equivalent to 6.78% of Intekplus’ 98.77 billion won in revenue last year.

Intekplus will supply two types of equipment from its iPIS series for semiconductor package and chip inspection and its iSIS series for semiconductor mid-end and substrate inspection. The specific models were not disclosed.

The iPIS lineup includes systems for final visual defect inspection of semiconductor packages, 3D dimensional inspection and 2D side inspection. The iSIS lineup includes systems for 3D inspection of microbumps on flip-chip substrates and 3D inspection of bumps and surface defects on flip-chip ball grid array (FC-BGA) substrates.

Payments will be made in four stages. Intekplus will receive 30% of the contract value as an advance payment and another 30% after equipment delivery. A further 30% will be paid after installation and commissioning are verified, with the remaining 10% due after final acceptance. The contract runs through Nov. 30 next year, with the final payment expected before then.

Intekplus recently won an order from a major Japanese substrate manufacturer for automated optical inspection (AOI) equipment used in glass-substrate research and development. The equipment will be delivered in the second half of this year. The number of systems and contract value were not disclosed.

Intekplus posted first-half revenue of 21.77 billion won and an operating loss of 7.03 billion won. Its first-half net loss widened from a year earlier to 7.54 billion won.

U.S. semiconductor equipment maker Axcelis Technologies said Sept. 8 it plans to build a new equipment manufacturing facility in South Korea with an investment of about $35 million.

Robert Mahoney, Axcelis' Executive Vice President of Global Operations, recently participated in an investment declaration ceremony in Washington, D.C., with officials from South Korea's Ministry of Trade, Industry and Resources (MOTIR) and the Korea Trade-Investment Promotion Agency (KOTRA). The investment totals $35 million.

The new manufacturing facility will be built in Pyeongtaek with a total gross floor area of about 200,000 square feet. The investment is aimed at expanding ion implantation equipment production capacity to meet global demand.

Ion implanters are key front-end semiconductor manufacturing tools that precisely introduce ions into wafers to create desired electrical properties. Axcelis Korea established the Axcelis Asia Operations Center (AAOC) in Pyeongtaek in 2021 and began producing the equipment locally.

The new facility will be designed around a lean manufacturing environment aimed at eliminating waste and maximizing production efficiency. A groundbreaking ceremony is scheduled for Oct. 20, with production targeted to begin in the second half of 2028.

The facility will include Class 1,000 (ISO 6) and Class 10,000 (ISO 7) cleanrooms, a warehouse and a training center. A Class 1,000 cleanroom limits particles measuring 0.5 micrometers (㎛) to no more than 1,000 per cubic foot.

"Ion implanters are among the most important tools in front-end semiconductor manufacturing," Axcelis President and Chief Executive Officer Russell Low said. The investment will strengthen the company's global high-volume manufacturing infrastructure and expand the capabilities needed to serve customers worldwide, he said.

Qualcomm has announced a semiconductor partnership with Amazon for artificial intelligence data centers, tied to warrants and a potential deal worth up to $60 billion.

Qualcomm said Sept. 8 it began a product collaboration with Amazon to build next-generation AI data center infrastructure. The partnership aims to supply cost-efficient custom application-specific integrated circuits (ASICs) for large-scale AI inference workloads on Amazon Web Services (AWS). ASICs are dedicated chips optimized for specific computing tasks or services.

"As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency," Qualcomm Chief Executive Officer Cristiano Amon said. "Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure."

The companies will also jointly design high-performance optical connectivity solutions to address rising data traffic and bandwidth requirements in data centers. The solutions will target transmission speeds of up to 1.6 terabits per second (Tbps), using Qualcomm's high-speed serializer/deserializer (SerDes) and optical digital signal processor (DSP) technologies.

SerDes chips convert slower parallel signals inside semiconductors into a single high-speed serial data stream for transmission. Optical DSPs precisely compensate for signal distortion and loss as optical data travels through fiber.

Qualcomm Chief Financial Officer Akash Palkhiwala said the Amazon collaboration could generate a potential revenue opportunity of as much as $60 billion. He added that Amazon's selection validates Qualcomm's data center technology, strategy and ability to supply products at scale.

Up to $60 Billion Over 10 Years

The potential revenue cited by Palkhiwala is linked to Qualcomm's issuance of warrants, which give Amazon the right to purchase shares at a specified price in the future. Qualcomm plans to vest the warrants in stages based on Amazon's purchases of its data center ASICs and optical connectivity solutions. Amazon's maximum contracted purchase amount is $60 billion, with the agreement running for 10 years.

Amazon has already secured 15% of the warrants after committing to purchase Qualcomm products at the initial stage of the agreement. The product volume is estimated at about $9 billion.

Qualcomm has also received purchase orders (POs) from Amazon and begun chip production. Revenue from the chips is expected to be recognized starting in December. That makes Qualcomm's previously announced fiscal 2027 data center revenue forecast of about $5 billion increasingly likely to be achieved.

Qualcomm also plans to expand its use of Amazon's AI platform to shorten semiconductor design cycles. The company will increase the use of services including Amazon Bedrock in electronic design automation (EDA) workloads.

EDA involves using software to design semiconductor circuits and verify their performance. Amazon Bedrock is a fully managed generative AI service that allows developers to use pretrained generative AI models in cloud environments for their specific workflows and applications.

Qualcomm's data center ASICs are part of its Dragonfly portfolio. In addition to custom silicon, Dragonfly includes the C1000 central processing unit (CPU), AI300 AI inference accelerator and connectivity products.

Taesung said Sept. 9 it is showcasing glass substrate production equipment technology at the International Semiconductor Substrate & Advanced Packaging Industry Exhibition, or KPCA Show 2026.

KPCA Show is a South Korean exhibition specializing in printed circuit boards (PCBs) and semiconductor packaging. The event is being held Sept. 9-11 at Songdo Convensia in Incheon. Taesung is presenting process technologies optimized for glass substrates, including etching, cleaning and plating, at its booth.

In particular, the company is showcasing key equipment for the Through Glass Via (TGV) process. TGVs are tiny holes formed in glass substrates to create electrical signal paths between chips and substrates. Taesung is displaying etching equipment that shapes and refines the holes, cleaning equipment that removes contaminants and plating equipment that coats the holes with metal to enable electrical conductivity.

Taesung has developed equipment for each stage of glass substrate processing based on technology accumulated in its existing PCB manufacturing equipment business. The company is targeting the market with mass-production solutions tailored to different manufacturing methods and process conditions for individual customers. Supply discussions with major customers are currently in their final stages, and Taesung expects to secure new orders within this month.

"Global demand for glass substrates is growing as AI semiconductors become more powerful and advanced packaging technologies develop," Taesung said. "We will actively showcase our differentiated process equipment technology at KPCA Show."

The growing AI and high-performance computing (HPC) markets are also increasing the importance of next-generation semiconductor packaging technologies. Glass substrates, a next-generation packaging material, have flatter surfaces than conventional substrates made of plastic or organic materials, making them better suited for denser, finer circuit patterns. They are also less susceptible to warpage and deformation caused by heat.

Samsung Electronics said Sept. 9 that it will jointly develop artificial intelligence (AI) models with Mistral AI specialized for semiconductor design and manufacturing.

The two companies formed a strategic partnership on the occasion of the South Korea-France summit held the same day. Samsung previously made a large equity investment in Mistral AI, laying the foundation for long-term technology cooperation and joint business initiatives. The Series D funding round for Mistral AI led by Samsung totaled €3 billion.

The companies will develop semiconductor-specific AI combining semiconductor technology and manufacturing data from Samsung’s Device Solutions (DS) division with Mistral AI’s AI model technology. The specialized AI will be deployed in stages across Samsung’s semiconductor operations, from chip design to manufacturing data analysis, defect prediction and process optimization. The goal is to shorten development time, improve manufacturing efficiency and quality, and enhance productivity and precision across semiconductor operations.

The companies will also jointly build an AI platform and operating system optimized for semiconductor operations using an on-premises approach. On-premises systems are built and operated on a company’s own servers and data centers. The approach is intended to enable Samsung to securely use semiconductor-related data without transferring it outside the company.

Samsung plans to expand its cooperation with Mistral AI across its DS division, from memory to semiconductor foundry and logic businesses. It will also accelerate AI transformation (AX) across all business units. The company ultimately plans to build an AI-based semiconductor ecosystem that can connect customers and partners.

“As the complexity of semiconductor design and manufacturing increases rapidly, the ability to use vast amounts of data securely and precisely through AI is emerging as a key competitive advantage,” said Jun Young-hyun, vice chairman and head of Samsung Electronics’ DS division. “By building AI models and platforms specialized for the semiconductor industry with Mistral AI, we will establish a new standard for AI-driven semiconductor innovation.”

“AI is redefining the creation of advanced technologies, from semiconductors to software,” said Arthur Mensch, co-founder and chief executive officer of Mistral AI. “Through our collaboration with Samsung Electronics, we will contribute to advances in semiconductor design and manufacturing and across the global AI value chain.”

Mistral AI is a French AI company that has developed high-efficiency large language models (LLMs) including Mistral Large. It was founded by AI researchers formerly at Google DeepMind and Meta. The company has technology for building customized on-premises AI models for industries requiring high levels of data security, including finance, manufacturing and energy.

Samsung Electronics plans to become the first in the industry to introduce high-numerical-aperture (High-NA) extreme ultraviolet (EUV) lithography equipment from Dutch semiconductor equipment maker ASML into advanced DRAM manufacturing facilities by 2028. The companies will also jointly develop large 300mm photomasks.

Samsung Electronics announced the expanded cooperation with ASML on next-generation semiconductor manufacturing on Sept. 8.

"Building on the results of our existing cooperation with ASML, we will accelerate the development and adoption of next-generation technologies needed to manufacture advanced artificial intelligence (AI) semiconductors," Samsung said. "The cooperation means High-NA EUV technology is ready for full-scale application in advanced memory, following its use in foundry manufacturing processes."

High-NA refers to a numerical aperture of 0.55, a measure of a lens's ability to collect light. Low-NA EUV equipment has a numerical aperture of 0.33. The improved light-gathering capability allows High-NA systems to print finer and more precise semiconductor circuit patterns than Low-NA equipment.

Samsung plans to use the ultra-fine patterning technology to overcome the limits of DRAM scaling. It also aims to simplify circuit-forming processes and improve productivity.

○ Samsung Joins 300mm Photomask Consortium

Samsung will also participate in a large-mask consortium led by ASML. The consortium was formed to transition the photomask standard for semiconductor lithography equipment to 300mm.

Samsung will play a key role in the transition to 300mm photomasks based on its experience in memory manufacturing and semiconductor foundry production, as well as its track record in EUV operations. Consortium members will jointly review global technology trends in lithography equipment and photomasks.

A photomask is a precision template used to form microscopic electronic circuits on semiconductor wafers. Inside lithography equipment, light is projected through the mask to transfer circuit designs onto a wafer. Patterning precision affects semiconductor computing performance and yield.

The industry has traditionally used 150mm photomasks. With 150mm masks, High-NA EUV equipment has about half the exposure field of Low-NA EUV systems, meaning the area that can be patterned in a single exposure is smaller. Large chip circuits therefore need to be exposed in two sections. This is because the optical system was modified to prevent light interference and shadowing effects.

The separately exposed circuit sections must then be connected through a process known as stitching. Switching to 300mm masks eliminates the stitching constraint. This can reduce process steps, improve productivity and lower chip manufacturing costs. Samsung believes 300mm masks will be necessary to maximize the performance of High-NA EUV equipment in advanced semiconductor manufacturing, where tens of billions of transistors are densely packed onto a chip.

"Samsung Electronics is strengthening its leadership in advanced semiconductor manufacturing, including foundry and memory," said Jun Young-hyun, vice chairman of Samsung Electronics. "By strengthening our cooperation with ASML, we will establish the technology foundation for the next generation of AI."

"Samsung Electronics has long been one of ASML's most important partners, and we have advanced semiconductor manufacturing technology together," said Christophe Fouquet, chief executive officer of ASML. "In the new era driven by AI, we will continue to lead next-generation semiconductor manufacturing innovation together with Samsung Electronics."

The Korea Electronics Packaging and Circuits Association (KPCA) said Sept. 7 that it conducted an advanced semiconductor packaging industry training program in Taiwan.

The Taiwan advanced packaging program was jointly organized by KPCA, Gyeongsang National University and Pukyong National University. A total of 16 people participated, including students specializing in semiconductor packaging, two professors from Gyeongsang National University and two KPCA officials.

The program was designed to give Korean students firsthand experience of the global semiconductor industry and help them understand Taiwan's semiconductor packaging and printed circuit board (PCB) ecosystem. Participants visited copper-clad laminate maker Elite Material Co. (EMC), Lunghwa University of Science and Technology, the Taiwan Printed Circuit Association (TPCA) and SEMICON Taiwan 2026.

EMC is a materials company that produces copper-clad laminates (CCLs), which are used to manufacture PCBs. The visit gave participants an opportunity to observe semiconductor and electronics technologies and production sites. It also helped deepen their understanding of changes in the global supply chain and the direction of the advanced packaging industry.

At Lunghwa University of Science and Technology, participants examined Taiwan's industry-academia cooperation and semiconductor workforce training system. During their visit to TPCA, they learned about Taiwan's PCB and semiconductor packaging industries, global competitiveness, industrial ecosystem and workforce development policies.

At the final stop, SEMICON Taiwan 2026, participants explored the latest technologies and market trends across the global semiconductor industry. They reviewed developments in advanced packaging, high-bandwidth memory (HBM), chiplets and 2.5D and 3D packaging, technologies that are gaining importance amid the rapid growth of artificial intelligence (AI) semiconductors. SEMICON Taiwan is an exhibition for sharing advanced semiconductor technologies.

"For Korea to continue growing as a global semiconductor powerhouse, not only industry but also universities and research institutions need to work together to systematically develop future professionals," KPCA said. "KPCA will expand cooperation with universities, companies and related organizations to cultivate talented professionals who will lead the PCB and semiconductor packaging industries and strengthen global industry-academia collaboration."

KPCA is building a cooperative framework connecting industry, government, universities and research institutions. The effort is aimed at strengthening the competitiveness of Korea's PCB and semiconductor packaging industries and expanding global cooperation.

Qualcomm is expanding the reach of its Snapdragon platform beyond smartphones, positioning the brand at the center of the emerging personal artificial intelligence (AI) era. By extending Snapdragon across smartphones, PCs, automobiles, wearables and extended reality (XR) devices, the company aims to strengthen its market leadership through a unified AI ecosystem.

According to Qualcomm, Snapdragon platforms have now shipped in more than 3.5 billion devices worldwide. Since debuting in smartphones in 2007, Snapdragon has evolved into a consumer platform spanning wearables, PCs, vehicles and XR devices. Qualcomm's next objective is to expand the Snapdragon ecosystem to enable AI agents to operate seamlessly across multiple devices, replacing today's fragmented, device-specific experiences.

Cristiano Amon, Qualcomm's chief executive officer, underscored that vision during Samsung Electronics' Galaxy Unpacked 2026 event on July 22.

"Personal devices will become the ultimate destination for AI agents," Amon said. "That means high-performance, power-efficient on-device computing and reliable connectivity will become increasingly important, and Qualcomm provides the technologies needed to make that possible."

Samsung unveiled several Snapdragon-powered personal AI devices during the event. The Galaxy Z Fold8 Ultra and Galaxy Z Flip8 are powered by the Snapdragon 8 Elite Gen 5 for Galaxy, while the Galaxy Watch9 and Galaxy Watch Ultra2 use the Snapdragon Wear Elite platform. Samsung's Intelligent Eyewear smart glasses also incorporate Qualcomm's Snapdragon AR1 Gen 1 platform.

Qualcomm's strategy of expanding the Snapdragon ecosystem reflects a broader shift in the way consumers experience digital services. In the past, smartphones served as the primary gateway to digital experiences, while wearables largely complemented or extended smartphone functionality.

The rise of agentic AI is changing that paradigm by enabling consistent digital experiences regardless of device form factor. Personal AI systems can understand a user's intent and context, allowing them to deliver personalized services across multiple devices. During his keynote address at MWC 2026, Amon said the industry was moving beyond a smartphone-centric ecosystem.

"Until now, everything revolved around the smartphone," he said. "Going forward, every device will exist around the AI agent."

Competition among mobile chipmakers is also shifting toward AI-driven user experiences. Industry participants increasingly emphasize the importance of AI agents delivering continuous, coordinated experiences across multiple devices rather than maximizing performance on a single product.

Kim Won-joon, executive vice president and head of development at Samsung Electronics' Mobile eXperience (MX) Business, echoed that view.

"A premium experience can no longer be defined by a single product," Kim said. "The intelligence that connects all devices together is what defines a premium experience."

To deliver a consistent digital experience across multiple devices, sufficient computing performance and stable connectivity are essential. Qualcomm says it is positioning Snapdragon as a platform capable of providing a unified AI experience regardless of device form factor by optimizing central processing units (CPUs), graphics processing units (GPUs), neural processing units (NPUs) and connectivity technologies within a single integrated system.

One example is the Snapdragon 8 Elite Gen 5 for Galaxy, which combines Qualcomm's proprietary Oryon CPU architecture, Adreno GPU, Hexagon NPU and FastConnect 7900 connectivity system, all optimized specifically for Galaxy smartphones. The platform is designed to deliver flagship-class performance and responsiveness while maintaining high power efficiency.

The chipset also enables intelligent camera functions, enhanced gaming performance and AI-powered connectivity for more responsive real-time AI experiences. It supports video playback at up to 8K resolution (7,680 × 4,320) at 60 frames per second, while compatibility with AV1 and H.265 codecs helps reduce battery consumption during extended video streaming.

The Snapdragon Wear Elite platform introduces another industry first by integrating an NPU into a wearable processor. It can run AI models with up to 1 billion parameters directly on the device without relying on cloud connectivity. This enables AI agent capabilities such as contextual awareness, natural voice interaction and continuous personal activity logging.

The platform also incorporates Qualcomm's first multimode connectivity architecture integrating six next-generation communication technologies into a single chip. It supports 5G RedCap, designed for lower-power 5G connectivity, micro-power Wi-Fi and Bluetooth 6.0 for precise device-to-device communication, allowing continuous collection of contextual signals to enhance personal AI experiences.

Similarly, the Snapdragon AR1 platform for smart glasses combines an ultra-lightweight, low-power design with sufficient processing capability to support AI agents. It integrates an NPU, a visual analysis engine and enhanced memory to provide stable wireless streaming and AI-powered computing within compact wearable devices.

Snapdragon has already established a strong position in the premium mobile market. According to Qualcomm, 61% of South Korean consumers identify Snapdragon as a key factor in improving the experience of premium Android devices.

By expanding the Snapdragon ecosystem across a broader range of connected products, Qualcomm aims to strengthen its competitiveness in the personal AI era while reinforcing its leadership in the intelligent device market.

South Korean semiconductor inspection equipment maker Nextin will begin production qualification testing of two inspection systems with a European semiconductor manufacturer, marking its first supply of inspection equipment for logic semiconductor production.

According to industry sources, Nextin plans to deliver its front-end inspection system AEGIS 3 and back-end inspection platform KROKY to the customer in the third quarter. The equipment will be installed on the customer's production line for evaluation of performance and suitability for mass production. The identity of the customer was not disclosed.

A Nextin official said the company could not reveal the customer due to a non-disclosure agreement (NDA) but noted that the logic semiconductor market has high entry barriers and currently represents a larger share of global semiconductor equipment investment than the memory segment.

Among European semiconductor manufacturers operating front-end fabrication facilities are STMicroelectronics, NXP Semiconductors and Bosch. These companies primarily produce chips using mature process technologies of 28 nanometers and above, including automotive microcontroller units (MCUs) and power semiconductors.

Nextin's AEGIS system is a front-end 2D imaging inspection tool used during wafer fabrication, where microscopic circuit patterns are formed on semiconductor wafers. The system illuminates the wafer surface and captures circuit images using multiple CMOS sensors. It detects nanometer-scale pattern defects and foreign particles by comparing captured images with reference patterns.

The tool incorporates both bright-field (BF) and dark-field (DF) optical inspection technologies. Bright-field inspection uses reflected light, while dark-field inspection relies on scattered light, allowing customers to select inspection modes according to process requirements.

KROKY is an optical defect inspection platform designed for semiconductor back-end processes. The system uses high-performance time-delay integration (TDI) sensors to enable fast, high-density imaging.

Target applications include power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN), as well as advanced packaging structures for high-bandwidth memory (HBM), including through-silicon vias (TSVs), redistribution layers (RDLs) and final assembly inspection. By performing BF and DF inspections within a single system, KROKY can reduce process time and improve throughput. The platform also incorporates AI-based deep-learning algorithms to enhance defect classification accuracy.

The product family includes two models: KROKY-W and KROKY-R. KROKY-W is designed to evaluate thin-film uniformity before device wafers are diced into individual chips. KROKY-R inspects individual dies after dicing and can identify defects such as cracks, chipping and wafer warpage with high precision.

Given the technical requirements of the mature-node manufacturing processes commonly used by European semiconductor producers, industry sources expect the production qualification process to take approximately six months. If evaluations are completed successfully within the first and second quarters of 2027, the customer could proceed with formal purchase orders and volume production supply agreements.

Nextin plans to leverage the qualification program as a reference case to expand its customer base in the global logic semiconductor market.

SanDisk announced on Aug. 6 that it will unveil next-generation NAND technologies for artificial intelligence (AI) applications at Future of Memory and Storage (FMS) 2026.

The technologies to be showcased include High Bandwidth Flash (HBF), next-generation NAND products and enterprise solid-state drives (SSDs). The solutions are designed for AI computing environments such as high-speed data lakes, model storage, retrieval-augmented generation (RAG) and key-value (KV) cache workloads. SanDisk plans to demonstrate how these technologies can address the diverse requirements of AI inference.

HBF is a NAND-based memory technology. Similar to High Bandwidth Memory (HBM), it vertically stacks NAND dies to increase data transfer speeds. The technology delivers high-bandwidth performance while offering greater capacity scalability than DRAM because it is NAND-based. HBF is designed for large-scale AI inference workloads that require both high bandwidth and large memory capacity.

SanDisk is participating in the HBF Specification Standardization Consortium alongside SK hynix. On Aug. 4, the consortium released its first HBF standard. The specification defines two configurations using eight-layer and 16-layer NAND die stacks. Maximum memory capacity is set at 512GB, while bandwidth is categorized into three performance tiers ranging from 0.4 terabytes per second (TB/s) to 3TB/s.

The company will also present its next-generation BiCS10 quad-level cell (QLC) NAND technology. The 3D NAND product is designed to improve density, performance and power efficiency to meet growing storage demand from AI data centers and cloud computing environments. SanDisk shipped samples of its BiCS10 triple-level cell (TLC) NAND last month.

In the enterprise SSD segment, SanDisk will showcase products based on the PCI Express (PCIe) 6.0 standard. The SSDs are designed in the E3.S form factor, a next-generation server storage specification. The products feature enhanced endurance for KV cache applications and reduced onboard DRAM requirements to maximize storage capacity. DRAM inside SSDs is typically used to store mapping tables that track the location of stored data.

The company will also introduce its AI Data Cycle Framework, an enhanced version of SanDisk’s proprietary framework designed to provide a comprehensive view of storage requirements across AI workloads. AI storage systems are used for functions including raw data archives, high-speed data lakes, model training, inference and generative content repositories.

“Growing inference workloads are creating demand for memory and storage technologies that can deliver optimal performance, capacity and power efficiency,” said Khurram Ismail, Chief Product Officer at SanDisk.

Machine vision inspection system company iVisionWorks has begun developing semiconductor wafer inspection equipment, the company announced on Aug. 5.

The new system will be a wafer metrology and inspection platform built on a high-sensitivity optical architecture. The market is currently dominated by overseas suppliers such as KLA and Hitachi High-Tech. iVisionWorks said it aims to develop a product that can compete on both defect detection capability and inspection speed.

The company plans to complete proof-of-concept (PoC) testing in the second half of this year and finish a prototype in the first half of next year. The prototype will then be used for customer evaluations.

Wafer inspection systems are used to identify defects generated during semiconductor manufacturing processes. Their performance has a significant impact on production yield and manufacturing efficiency.

Demand for wafer inspection equipment has been rising rapidly as the global expansion of artificial intelligence drives increased semiconductor production.

According to market research firm Fortune Business Insights, the global semiconductor defect inspection equipment market was valued at approximately $6.14 billion in 2025 and is projected to reach about $13.41 billion by 2034.

"We are concentrating our company-wide capabilities on entering the semiconductor inspection equipment market," said Gil Gi-jae, Chief Executive Officer of iVisionWorks.

"The semiconductor inspection equipment market has high technological barriers to entry, but we intend to leverage our accumulated precision optical technologies to establish a position in the sector and secure a new growth momentum," he added.

iVisionWorks currently supplies machine vision inspection equipment for secondary battery manufacturing processes.

Machine vision systems are automated measurement and identification platforms that combine optical hardware, software and image-processing technologies to inspect products and manufacturing processes.

Samsung Electronics unveiled next-generation 3D memory technologies, including z-axis High Bandwidth Memory (zHBM) and zNAND-O, as the company seeks to strengthen its position in the rapidly growing artificial intelligence market.

Samsung on Aug. 5 showcased mockups of zHBM and zNAND-O for the first time at the Future of Memory and Storage (FMS) 2026 conference in California. During a keynote presentation on Aug. 4 local time, the company also outlined its vision for maximizing performance and power efficiency in high-performance computing (HPC) and AI systems through the use of zHBM, zNAND-O and other advanced memory technologies.

zHBM Delivers Up to Eight Times Higher Performance Through New Architecture

zHBM is a next-generation architecture that vertically stacks HBM on top of AI accelerators, or xPUs, along the z-axis. The design minimizes the distance data must travel between memory and AI processors, improving bandwidth and power efficiency while supporting the ultra-high-speed data processing required for training and inference of large-scale AI models.

Conventional architectures place HBM around the AI accelerator. Samsung said that approach faces limitations in meeting the performance requirements of next-generation HPC and AI infrastructure.

According to the company, zHBM can deliver up to eight times the data-processing performance of eighth-generation High Bandwidth Memory (HBM5) while improving performance per watt by a factor of three. Thermal resistance is reduced by more than half, enhancing both system stability and energy efficiency.

Samsung described zHBM as a customizable family of 3D memory products. The architecture allows customers to add semiconductor intellectual property (IP) blocks to an interlayer positioned between the memory and AI accelerator. These blocks can be tailored to expand memory capacity or optimize accelerator performance for specific workloads.

The company said it plans to work closely with customers to co-optimize AI processors and memory systems and maximize the performance potential of zHBM.

Samsung Reveals HBM-Like zNAND-O and 400-Plus-Layer V10 BV-NAND

Samsung also introduced zNAND-O, a next-generation high-performance NAND flash family currently under development. The technology combines Samsung's vertical V-NAND stacking architecture with Through-Silicon Via (TSV) technology. TSVs are used in HBM to electrically and physically connect vertically stacked DRAM dies. Samsung's zNAND-O adopts a structure similar to High Bandwidth Flash (HBF), which is being developed by SK Hynix and Sandisk.

The "O" in zNAND-O refers to on-device AI applications. Samsung demonstrated four-layer and eight-layer 3D-packaged V-NAND configurations designed to deliver high space efficiency, increased read bandwidth and faster response times. The company said the technology is well suited for environments requiring real-time processing of large volumes of data.

During the keynote, Samsung also unveiled its V10 Bonding Vertical (BV)-NAND technology featuring more than 400 layers. The next-generation NAND architecture improves both performance and power efficiency. The displayed zNAND-O mockup was built using the V10 NAND platform.

BV-NAND separates the NAND cell array and peripheral circuitry onto different wafers before vertically bonding them together. The process utilizes advanced wafer-bonding technology that enables three-dimensional integration of multiple wafers.

Samsung further combines the approach with a three-stack architecture, in which V-NAND cells are manufactured in three separate stacks and then vertically interconnected. The company said memory density improves by approximately 58% compared with the previous V9 generation, enabling greater storage capacity within the same footprint. Read, write and input/output performance have also been enhanced.

HBM4E, HBM5 and Processing-in-Memory Technologies Also Displayed

Samsung's exhibition area featured more than 30 memory products spanning DRAM and NAND technologies. Highlights included a next-generation AI computing platform based on HBM4E, wafer samples, and an HBM5 mockup incorporating Heat Path Block (HPB) technology. HPB adds vertical heat-dissipation channels along the sides of HBM core dies to improve thermal management.

The company also showcased LPDDR5X-PIM, which combines low-power LPDDR5X DRAM with Processing-in-Memory (PIM) functionality. Samsung described the product as the world's first implementation of its kind, enabling more efficient data movement and improved power efficiency.

Storage products optimized for AI workloads were also displayed, including the PM1763 and BM1773. PM1763 is Samsung's next-generation enterprise solid-state drive (SSD), designed for high-speed reading and efficient data processing. BM1773 is an ultra-high-capacity enterprise SSD aimed at supporting large-scale AI training datasets.

Samsung emphasized that it remains the world's only integrated device manufacturer (IDM) capable of providing a one-stop solution spanning memory, logic semiconductors, foundry services and packaging.

"We can provide integrated services from the product design stage through mass production, helping customers shorten development cycles while optimizing performance and power efficiency," the company said. "This enables customized AI semiconductor solutions tailored to customer requirements."

Semiconductor test equipment maker DI is expected to post record quarterly results in the second quarter.

Hana Securities estimated on July 24 that DI will report second-quarter revenue of 160.6 billion won and operating profit of 33.1 billion won. That would represent increases of 34.7% and 169.8%, respectively, from a year earlier, marking the company's highest quarterly figures on record. Combined with first-quarter operating profit of about 18.9 billion won, first-half operating profit is projected to reach 52.0 billion won, surpassing the company's full-year operating profit for last year within six months.

Behind the strong performance are wafer testers for sixth-generation high-bandwidth memory (HBM4) made by DI's subsidiary Digital Frontier (DF). Earlier this year, DF won orders worth 196 billion won from SK hynix for the equipment.

Those deliveries were concentrated in the second quarter. As a result, DF's second-quarter revenue is expected to increase 76.8% from the previous quarter to 96.2 billion won. HBM4 testers also carry higher margins, with the subsidiary's operating margin estimated to have risen to 30% from 26% in the first quarter.

DI's standalone second-quarter revenue is also expected to exceed 60 billion won, supported by higher shipments of package testers. Package testers are used in the step following wafer testing. They inspect semiconductor packages — chips that have been diced from wafers, wrapped in protective material and assembled into finished form. DI has a product lineup capable of testing DRAM, NAND flash and non-memory semiconductors, with Samsung Electronics as its key customer.

The second-half outlook is also positive. Discussions are underway on additional HBM4 tester supply, which is expected to extend related revenue through the end of this year. Commodity DRAM prices have also risen sharply, accelerating customers' capital spending. DF is continuing to ship its own DRAM package testers, and supply of NAND wafer testers began in the third quarter.

Because memory manufacturers had concentrated their existing capital spending on HBM, investment in commodity products is expected to expand over an extended period.

Hana Securities forecast DI's consolidated third-quarter revenue at more than 180 billion won. It estimated full-year revenue of 573 billion won and operating profit of 101.3 billion won.

Customer investment is expected to continue next year. SK hynix will open the cleanroom at P&T7, a semiconductor back-end packaging and test plant in Cheongju. The plant will produce HBM using a 2.5D packaging process. In NAND, Samsung Electronics plans an expansion of its P5 fab at the Pyeongtaek Campus, while SK hynix has also planned an investment in its new M17 fab in Cheongju.

TRUMPF Korea has expressed strong confidence in achieving double-digit revenue growth for its 2026–2027 fiscal year, which began in July. The company expects to benefit from growth in the semiconductor sector, rising demand for machine tool automation, and the resumption of investments across previously stagnant industrial sectors.

Founded in 1923, TRUMPF is a representative German "hidden champion"—a term referring to highly competitive industry leaders that are not widely known to the general public. TRUMPF is widely recognized as the exclusive supplier of the "drive laser"—a carbon dioxide (CO₂) laser source—used in ASML's extreme ultraviolet (EUV) lithography systems. The company operates four primary divisions: Machine Tools, Laser Technology, Power Electronics, and its EUV Lithography division.

"In the previous fiscal year, our Korean branch faced operational challenges due to rising exchange rates and downturns in the battery and display industries," said Geun-min Ryu, managing director of TRUMPF Korea. "However, this year, driven by advances in laser technology and machine tool automation, we expect to achieve double-digit growth and surpass 200 billion won in revenue."

One product line expected to fuel this growth is the Power Electronics division's radio frequency (RF) generator module, which is installed in semiconductor etching and deposition equipment. Driven by the rapid surge in High Bandwidth Memory (HBM) demand, the market for related processing equipment is expanding, which in turn is boosting module sales.

The transition toward laser technology in semiconductor wafer dicing is another major growth opportunity. Wafer dicing involves cutting device wafers after front-end fabrication for back-end packaging. TRUMPF's global R&D team is currently co-developing a "pure laser dicing" process with LeadroTech, which cuts wafers using lasers alone. TRUMPF is also actively communicating and conducting technology validation with domestic memory semiconductor manufacturers.

Compared to traditional mechanical cutting, pure laser dicing lowers the risk of micro-cracks or defects on semiconductor chips. By preventing physical damage to high-cost chips, it helps customers reduce yield loss. Currently, manufacturers rely primarily on mechanical blades, using lasers only in a supplementary role.

However, achieving high yields with laser dicing requires precise power control, ultra-short pulse-width optimization, and thermal management technology. "We expect customer equipment featuring this technology to undergo validation testing in South Korea around early next year," Ryu explained. TRUMPF does not manufacture complete semiconductor processing equipment directly. Instead, it supplies components like laser sources and RF generators to equipment manufacturers, who then deliver the fully assembled systems to semiconductor producers.

In TRUMPF's machine tool division—a stable source of revenue—demand for automation solutions is rising steadily. As manufacturing sectors face severe labor shortages, finding skilled equipment operators has become increasingly difficult. TRUMPF's machine tools are widely used in manufacturing for metal bending, cutting, and punching. "In the past, most customers purchased standalone machine tools. Today, not only large corporations but also small job shops are actively adopting automated systems that operate unmanned during nights or weekends," Ryu noted. This trend has driven steady sales growth for the machine tool division in South Korea.

TRUMPF also anticipates expanded investments across recovering downstream sectors such as batteries and displays. "In the battery sector, investments are shifting toward Energy Storage Systems (ESS)," Ryu said. "We also expect the domestic display industry's investments in new 6th-generation Organic Light-Emitting Diode (OLED) production lines to materialize soon." TRUMPF Korea supplies continuous-wave (CW) 'TruFiber' laser sources and optical sensors tailored for battery manufacturing, as well as the ultra-short pulse laser 'TruMicro' platform for glass processing.

Furthermore, the expansion of Hyundai Motor Group and its Tier-1 domestic suppliers into North American production hubs represents a positive driver. TRUMPF supplies 3D 5-axis laser processing machines to major automotive manufacturers and suppliers, holding a market share near 100%. With 71 subsidiaries and 11 production sites globally, TRUMPF provides rapid technical support and real-time predictive maintenance capabilities that detect equipment anomalies proactively.

Regarding glass substrate through-glass via (TGV) process investments, Ryu maintained a cautious stance. "TGV involves far more than simply drilling holes with a laser; it requires precise alignment across aspect-ratio control, copper plating, and sputtering processes," Ryu remarked. "While several domestic equipment makers are conducting pilot tests, it will take more time before mass-production equipment orders materialize."

Q&A

Q: Could you introduce TRUMPF and explain what kind of company it is?

A: TRUMPF was founded in 1923 and has a history of over 100 years. It is a family-owned business and a representative German "hidden champion." Because it is family-owned, there are no public shareholders, allowing the company to maintain a long-term operational vision without being bound by short-term profit margins. This structure enables us to invest heavily in long-term R&D. Globally, TRUMPF operates 71 subsidiaries and 11 production hubs, employing approximately 18,000 people. Our fiscal year runs from July to June, and global revenue reached approximately 7.5 trillion won in the previous fiscal year.

Q: Is the Laser Technology division your main core business?

A: Not exclusively. Globally, the Machine Tools division is TRUMPF's largest unit. It manufactures laser cutting machines, automatic and manual bending machines, punching machines, pipe processors, and combination machines that handle both punching and cutting. It also encompasses smart factory automation equipment that integrates directly with storage systems. In Germany, TRUMPF is widely known primarily as a machine tool company.

In the Laser division, we have transitioned from disc lasers to fiber lasers, and we provide ultra-short pulse lasers operating in picosecond (ps) and femtosecond (fs) ranges for ultra-precision processing. This division delivers core technologies to the semiconductor, display, automotive, and battery industries.

Thirdly, we have the Power Electronics division. With rising HBM demand, our RF generator modules serve as critical components in etching and deposition equipment.

Q: Are RF generator modules primarily supplied as modular components to equipment builders?

A: Yes, they are installed as modules within larger processing equipment. Lastly, we have the EUV Lithography division. We exclusively supply the CO₂ laser sources (drive lasers) used inside EUV lithography equipment. Based on those laser systems, equipment is supplied to key end-customers such as Samsung Electronics and SK Hynix.

Q: So the company consists of four main divisions?

A: Yes, there are four primary business divisions. Additionally, with the rise of AI, integrated services across all four divisions—covering machines, lasers, and generators—are becoming increasingly vital. Customers no longer focus solely on raw manufacturing capacity; they focus heavily on quality management, driving demand for integrated software solutions.

Q: So software solutions are bundled alongside those four divisions?

A: Yes. Customers in our Machine Tools division often purchase our software alongside equipment. Those using competitor equipment sometimes adopt compatible third-party software. The same applies to our Laser division. We supply not only laser sources, but also optical sensors like Optical Coherence Tomography (OCT) sensors and Programmable Focusing Optics (PFO) as bundled packages. While some customers buy full packages, System Integration (SI) equipment manufacturers may purchase only our laser sources and integrate their own software and sensors. We offer flexible options, ranging from standalone laser sources to comprehensive end-to-end solutions combining optics, sensors, software, and real-time process monitoring.

Q: Is revenue reported by division, or is service tracked as a fifth segment?

A: Service functions are embedded within each division, but because many service operations overlap, we manage and operate services across all divisions as a single unified structure.

Q: You mentioned recent global revenue was around 7.5 trillion won. What was it in prior fiscal years?

A: It typically ranged between 8.5 trillion and 9 trillion won. Between 2024 and 2025, overall macroeconomic downturns caused revenue to decline by about 15%. Beyond semiconductors, downturns in battery and industrial sectors across Germany, the US, and South Korea impacted performance.

Q: What is the revenue breakdown by division?

A: Machine Tools is the largest, accounting for over half of total revenue at around 4 trillion won. Laser Technology generates roughly 1 to 1.5 trillion won, while Power Electronics and the EUV Lithography division generate approximately 1 trillion won each.

Q: Machine Tools is indeed the largest unit.

A: Historically, Machine Tools has been our foundational business. Most customers know TRUMPF as a maker of sheet metal cutting, bending, and punching equipment. In South Korea, our customer base spans from very small job shops with a few employees to major industrial conglomerates.

Q: How long have you served as managing director of TRUMPF Korea?

A: I completed my studies in the United States and managed various R&D and business operations across the US and Europe before assuming the position of Managing Director for South Korea on July 1, 2025. I have just completed my first full fiscal year in this role.

Q: Is the revenue breakdown in South Korea similar to global proportions?

A: South Korea is unique in that the Laser division is significantly larger, accounting for more than half of our local revenue. It is essentially the reverse of our global breakdown. The remainder is divided among Machine Tools, Power Electronics, and the EUV Lithography division.

Q: After your first year in office, what key directives or goals has global headquarters emphasized?

A: Given my academic and professional background in laser R&D in the US, I have extensive experience in laser technologies. Having also worked for three years in our EUV lithography division in the Netherlands, I have hands-on experience across our business units. Headquarters tasked me with taking an active, customer-centric approach. Customers today look beyond raw productivity; they focus heavily on process efficiency, energy consumption, and automation due to severe field labor shortages. In line with headquarters' guidance, I spend most of my time visiting and communicating directly with clients nationwide.

Q: Is that customer-centric approach why TRUMPF Korea operates multiple regional service offices beyond its Seoul headquarters?

A: Yes. While our Dongtan and Pyeongtaek offices primarily support the EUV division, we also operate regional hubs in Cheonan, Daegu, Gwangju, and Busan. Because most of our customers are located along the Gyeongbu Highway axis, maintaining local hubs allows us to deliver technical support and service as quickly as possible.

Q: Have there been notable shifts in your revenue structure over the past year?

A: Our Machine Tools division faced challenges in the previous fiscal year but returned to growth this year. The Laser division maintained revenue levels similar to the previous fiscal year.

Q: Which specific areas are you focusing on personally?

A: While a managing director must oversee all business units, the Laser and Machine Tools divisions naturally take up a significant portion of my attention due to their size and scope. That is not to say Power Electronics or EUV are less important, but Laser Technology drives our largest revenue share, while Machine Tools encompasses the highest number of individual clients. Given my background in laser physics, I naturally have a strong affinity for the Laser division, and as our primary revenue driver, it requires close attention.

Q: Who are the main customers for the Laser division?

A: Unlike the Machine Tools client base, Laser division clients are primarily major corporations in high-tech industries such as semiconductors, displays, and automotive. While we sometimes deal with end-user conglomerates directly, our primary customers are equipment builders who integrate our lasers and optical sensors into their machinery, which is then delivered to manufacturing sites in South Korea, Vietnam, Hungary, the US, and beyond.

Q: Why do equipment manufacturers choose TRUMPF laser sources over competing alternatives?

A: The key factors are productivity and quality. We bring a long heritage of engineering expertise dating back to 1923. After transitioning from disc lasers to continuous-wave (CW) fiber lasers, our 'TruFiber' platform resolved performance drawbacks seen in competing products. For ultra-precision processing, our 'TruMicro' ultra-short pulse laser platform—specifically the 3000, 5000, and 6000 series—holds the leading market share in South Korea.

While TRUMPF lasers carry a premium price tag, they deliver high reliability, low defect rates, and optimal yield in mass production. Furthermore, our platform includes real-time process monitoring software, allowing defects to be identified instantly during processing—such as during battery welding—rather than after completion, preventing costly scrap. Our lasers contain numerous embedded sensors. Even if sensor readings trend upward while remaining within normal operational limits, our system detects the trend and proactively notifies the client to schedule preventive maintenance within three weeks before an actual fault occurs. This predictive maintenance model builds exceptionally high client trust.

Q: How are your lasers currently utilized across different applications?

A: Applications vary by industry. In semiconductors, our CO₂ lasers generate light sources for EUV lithography equipment. Standard CW lasers cut sheet metal and weld battery components. In display manufacturing, ultra-short pulse TruMicro lasers cut glass substrates with minimal thermal damage. In the automotive sector, global OEMs like BMW, Mercedes-Benz, and Hyundai Motor Group use our 3D 5-axis laser processing machines extensively for body frames and door processing.

Q: How are you addressing the trend toward Through-Glass Via (TGV) processing in semiconductor back-end packaging?

A: The surge in TGV interest from late 2025 has moderated into a more cautious evaluation phase. Because traditional printed circuit board (PCB) substrates remain highly reliable, the industry is verifying glass substrate adoption conservatively. TGV requires precise execution not only in laser hole drilling, but also in aspect-ratio control, copper plating, and sputtering. Currently, clients are operating pilot lines. While many customers have purchased our laser solutions for testing, current deployments remain limited to dozens of units rather than full mass-production scales, which would require hundreds of units. Substrate thickness demands are also shifting toward thicker glass (0.3T and 0.5T to over 1T). Follow-on orders for commercial mass-production equipment will take time, though we anticipate initial small-scale production deployments within the current fiscal year ending next June.

Q: Is the shift from mechanical wafer dicing to laser dicing gaining momentum?

A: Yes. Surging HBM demand has significantly heightened industry interest. TRUMPF Korea is actively collaborating with our German R&D team, partner firms, and domestic semiconductor leaders to co-develop applications this year.

Q: Does collaborating mean TRUMPF will build dicing equipment directly?

A: No. Standalone lasers cannot perform wafer dicing directly without risking thermal damage to adjacent chip edges. Because wafer processing occurs at the final stage of fabrication, micro-cracks or heat damage cause severe yield and financial losses. We are conducting R&D to enable "pure laser dicing" that minimizes thermal and physical damage.

Q: What technical approaches are being pursued?

A: We are collaborating with equipment makers and end-customers to optimize laser power control, pulse-width selection (picosecond or femtosecond), and thermal management mechanisms.

Q: Do you engage in direct transactions with end-customers for this?

A: We rarely transact directly with end-customers. We supply laser sources to equipment builders, who integrate them into complete tools, though we often participate jointly in R&D alongside end-customers.

Q: Are pure laser dicing tools currently deployed on active mass-production lines?

A: Current wafer dicing relies primarily on mechanical saw blades, with lasers playing a secondary role (such as stealth dicing). Pure laser dicing tools are still under development. Once commercialized, they will significantly reduce structural damage compared to mechanical blades. A similar transition occurred in smartphone cover glass processing, which shifted entirely from mechanical cutting to laser cutting to eliminate edge cracking. We are actively conducting R&D for both silicon (Si) and silicon carbide (SiC) wafers.

Q: What is the target timeline for commercial R&D milestones?

A: Initial tool testing in South Korea is targeted for late this year or early next year. Because semiconductor mass-production transitions require exhaustive qualification to avoid financial risks, adoption timelines will vary by customer.

Q: How does TRUMPF generate revenue in South Korea for EUV lithography laser sources?

A: Our local EUV division does not engage in direct sales activities. When domestic semiconductor manufacturers purchase EUV systems from ASML, TRUMPF headquarters supplies the drive laser units. Our local team handles installation, ongoing maintenance, and technical field support.

Q: So the laser source is installed separately from the main EUV tool?

A: In cleanroom fabs, you see the ASML lithography system. However, our CO₂ drive laser system is installed in the sub-fab level directly below. Installing a single drive laser system involves a dedicated engineering team working on-site over an extended period.

Q: TRUMPF holds an exclusive supply position for these drive lasers?

A: EUV lithography technology was developed through approximately 15 to 20 years of joint R&D between ASML, Zeiss, and TRUMPF.

Q: That means sales efforts are not required for that specific segment?

A: We do not take our position for granted. We continuously collaborate with ASML and Zeiss to increase laser output power. Equipment throughput—measured in wafers per hour (wph)—directly impacts customer return on investment. For High-NA EUV tools, the industry target is laser power exceeding 1 kilowatt (kW), whereas current operational levels remain below 500 watts.

Q: Is the laser source the main bottleneck in increasing output power?

A: It is not the sole factor. Generating EUV light requires firing laser pulses at falling tin droplets twice—at frequencies of 50 kHz to over 60 kHz. Managing energy generation, pulse timing, and optical collection involves complex interactions between the laser source, Zeiss optics, and overall tool design. ASML, Zeiss, and TRUMPF continuously optimize these integrated components together.

Q: What is TRUMPF Korea's revenue target for the current fiscal year?

A: Prior to my predecessor's retirement, annual revenue was slightly under 200 billion won. For the current fiscal year, we expect revenue to reach approximately 200 billion won. While this represents growth, I believe our technological capabilities position us to achieve even higher targets. As battery investments pivot toward overseas hubs and display investments recover, we anticipate further revenue momentum.

Q: Are there other key growth drivers?

A: Severe labor shortages are driving small job shops as well as large enterprises to adopt fully automated smart factory machine tools capable of running unmanned overnight and on weekends. Beyond machine tools, our RF generator and laser divisions are experiencing solid growth driven by EUV adoption, ESS battery production, and 6th-generation OLED investments. In the automotive sector, as Hyundai Motor Group and its Tier-1 suppliers expand production in North America, demand for our 3D 5-axis laser processing tools—where we hold near 100% market share—remains strong. Because our global service network supports clients seamlessly overseas, our products receive the same level of support abroad.

A significant recent challenge is currency exchange rates. Because our parent company reports in euros, translating TRUMPF Korea's revenue from won to euros results in an approximately 20% decline. This means we must achieve double-digit growth well beyond that baseline, which we believe is fully achievable.