SK hynix workers approved a revised 2026 wage and collective bargaining agreement in a union vote, three weeks after the first tentative agreement was rejected by a margin of 25 votes. The deal was reached after raising the cash portion of performance bonuses to 50%.

The revised agreement was approved with 8,731 votes, or 57.08%, in a two-day vote held by SK hynix's Icheon and Cheongju union from Sept. 15, according to results released Sept. 16. Of 16,039 eligible members, 15,297 voted, for a turnout of 95.37%.

The basic payout ratio for the company's profit-sharing (PS) bonus was adjusted to 50% cash and 50% stock. The first agreement called for 40% in cash and 60% in stock. The revised deal also gives employees the option to convert the cash portion into stock in increments of 10 percentage points.

Deferred portions of performance bonuses calculated based on last year's results that had been scheduled for payment next year and the following year will also be paid earlier. Single-parent households were added to the eligibility for additional housing loan support, which previously covered married households. The broader framework of the previous agreement, including a 6.3% wage increase and the deferral of a portion of wages in the event of losses, was maintained.

The first tentative agreement was rejected in an all-employee union vote on Aug. 25, with 7,535 votes, or 50.08%, against and 7,510 votes, or 49.92%, in favor. Labor and management then held about two weeks of additional negotiations and reached the revised agreement on Sept. 9.

SK hynix and the union will hold a signing ceremony for the final agreement before the Chuseok holiday, completing this year's wage and collective bargaining process.

"We thank the labor union and our employees for working with us through this difficult process," SK hynix said. "We will continue to work together as a company and employees to address and overcome the challenges we face."

Japan's Tokyo Ohka Kogyo (TOK) held a completion ceremony on Sept. 15 for its manufacturing facility in the Poseung district of Pyeongtaek, Gyeonggi Province. About 100 officials attended, including Gyeonggi Free Economic Zone Authority Commissioner Kim Neung-sik, Pyeongtaek Mayor Choi Won-yong, TOK President Noriaki Taneichi and TOK Advanced Materials CEO Kim Ki-tae.

TOK Advanced Materials will invest a total of 101 billion won on a 55,560-square-meter site to establish a high-purity chemical manufacturing facility in the first phase. The company also plans to build photoresist (PR) production capacity in the future. Of the total investment, 70.6 billion won is foreign direct investment. The project will create about 70 new jobs.

TOK Advanced Materials is the Korean subsidiary of TOK. TOK is the market leader in photoresists, supplying products to Samsung Electronics, SK hynix, TSMC and Intel. Photoresist is a key material used to form circuit patterns on silicon wafers during semiconductor patterning.

The project follows a memorandum of understanding (MOU) signed in April 2023 after the Gyeonggi Free Economic Zone Authority visited TOK's headquarters in Kanagawa Prefecture, Japan. The two sides discussed cooperation aimed at attracting a world-class semiconductor materials production base. The plant was completed three years after the investment was secured.

Gyeonggi Province has what it describes as the world's largest semiconductor cluster, linking semiconductor industry hubs including Pyeongtaek's Poseung and Hyeondeok districts with Yongin, Icheon, Hwaseong and Anseong. The Poseung and Hyeondeok districts are expected to become a hub for advanced materials within the semiconductor belt.

"Semiconductors are a strategic high-tech industry that determines national competitiveness," Kim Neung-sik said. "The completion of TOK's plant will help the region emerge as a hub for key semiconductor materials."

Orchem has introduced two plating approaches for metallizing through-glass vias (TGVs) in glass substrates. The company also unveiled a wet-process adhesion technology designed to improve bonding between glass and copper and between glass and insulating layers.

Orchem introduced its TGV plating and wet seed layer technologies at a technical seminar held during KPCA Show 2026 at Songdo Convensia in Incheon on Sept. 10. The company specializes in plating and surface-treatment chemicals used in semiconductor packaging and printed circuit board (PCB) manufacturing.

Orchem has developed two TGV plating approaches depending on substrate thickness and hole diameter. One is the bridge-fill method, commonly called center fill, which first forms a copper bridge at the center of the TGV hole and then fills the spaces above and below it. The other is the side-up fill method, which grows copper from the hole sidewalls toward the center.

The bridge-fill method uses Orchem's ZENITH-1000 plating solution. Filling the spaces above and below the copper bridge separately shortens overall plating time. The method is suited to TGVs with a low aspect ratio (AR). As substrates become thicker or hole diameters smaller, however, a higher AR can result in deeper enclosed holes, or blind vias, above and below the copper bridge.

ZENITH-1500 is used for side-up fill, in which copper grows across the entire TGV sidewall until the copper layers meet at the center. The approach can reduce void formation in high-AR TGVs. Orchem has completed plating evaluations on glass substrates up to 1 millimeter thick and is evaluating smaller hole diameters with aspect ratios of up to 20:1. Because copper grows across the entire hole sidewall, however, a thicker copper layer also forms on the substrate surface and plating takes longer.

Orchem has also developed an adhesion promoter (AP) to improve bonding between glass and copper or between glass and Ajinomoto Build-up Film (ABF). Glass has lower surface roughness than organic substrates, making it difficult to achieve sufficient adhesion. Palladium (Pd) catalysts used in electroless plating also have difficulty bonding copper to the glass surface.

The company synthesized the AP based on 3-aminopropyltriethoxysilane (APTES), a conventional silane-based adhesion material, by increasing the number of functional groups and molecular size. It is designed with separate functional groups that bond to glass and to copper or ABF, improving adhesion. The adhesion promoter can be wet-coated onto the glass surface before electroless copper plating. The coating is less than 100 nanometers thick.

Orchem also plans to commercialize bottom-up plating and a sputter-less process. Bottom-up plating grows copper from the bottom of a TGV hole and can reduce void formation even at high aspect ratios. The company is currently evaluating technology to uniformly form a seed layer at the bottom of the hole. The sputter-less process uses an adhesion promoter and electroless plating to form a copper seed layer without conventional sputtering. Orchem plans additional evaluations and aims to commercialize the adhesion material for the sputter-less process by year-end.

"TGV plating chemicals have already reached the commercialization stage," an Orchem official said. "Development of the adhesion material for the sputter-less process is complete, and our goal is to commercialize it by year-end after additional evaluation and validation."

TLB said it is participating in KPCA Show 2026 at Songdo Convensia in Incheon, marking the first time the company has set up an independent booth at the exhibition. It also won awards in three categories.

The company is showcasing printed circuit boards (PCBs) for Small Outline Compression Attached Memory Module (SOCAMM), Low Power Compression Attached Memory Module (LPCAMM) and Compute Express Link (CXL) memory modules. TLB is expanding beyond its core memory module business to address growing demand for high-performance, high-bandwidth memory in next-generation artificial intelligence (AI) servers and high-performance computing (HPC).

TLB also unveiled a PCB for high-speed memory modules supporting data rates of 8,600 MT/s, or 8.6 billion data transfers per second. As memory interface speeds increase, PCB design technologies that reduce signal loss and interference have become increasingly important.

The company is also displaying PCBs based on the Enterprise and Data Center Standard Form Factor (EDSFF) for solid-state drives (SSDs) used in data centers. EDSFF is a next-generation SSD form factor designed for data center applications.

TLB received the Best Booth Design Award, KPCA Education Award and Rising Partner Award at the exhibition. The company was recognized for effectively presenting its next-generation technologies through its exhibition space, as well as for its efforts to advance the PCB industry and strengthen future competitiveness.

“At our first exhibition at KPCA Show, we were able to showcase our next-generation products directly to customers and industry officials,” a TLB official said. “We will expand new business opportunities in AI, data centers and next-generation memory markets.”

Haesung DS said it showcased semiconductor substrate products including lead frames, package substrates and tape substrates at KPCA Show 2026 at Songdo Convensia in Incheon.

Lead frames are metal substrates that connect semiconductor chips to external circuits and provide structural support. Package substrates transmit electrical signals between semiconductor chips and mainboards. Tape substrates are thin-film substrates used for packaging components such as display driver integrated circuits (DDIs).

Haesung DS has participated in the event annually since 2023, presenting its key products and technologies. The company uses the exhibition to share technology and market trends with Korean and overseas customers and industry officials and explore potential business cooperation.

Haesung DS CEO Choi Young-sik received the Best Pathfinder Award at this year’s event in recognition of his active corporate management and commitment.

“We were able to introduce our technologies to industry officials,” a Haesung DS official said. “We will continue to strengthen our technological competitiveness and production capabilities to proactively respond to market and customer needs and actively identify new growth opportunities.”

SK hynix management and its labor union reached a revised tentative agreement on Sept. 9 that sets the basic performance bonus payment ratio at 50% cash and 50% stock. The union will hold a temporary delegates' meeting on Sept. 10, followed by a membership vote from Sept. 15 to 16.

The revised agreement retains the broad framework of a tentative deal reached last month while reducing the proportion of bonuses paid in stock. The previous agreement called for profit-sharing (PS) bonuses to be paid 40% in cash and 60% in stock. The revised plan sets both at 50%.

Employees can choose to increase the stock portion in increments of 10 percentage points, up to 100%.

Deferred portions of performance bonuses calculated based on last year's results, which had been scheduled for payment next year and the following year, will also be paid earlier. The measure is intended to reduce confusion as the bonus system shifts from primarily cash payments to a combination of cash and stock.

The company also revised part of its housing loan support program. Additional support beyond the basic program had been limited to married households, but the revised proposal extends eligibility to single-parent families.

SK hynix's Icheon and Cheongju full-time employee unions previously held a membership vote last month on a tentative agreement that included a 6.3% wage increase and changes to the PS payment structure. The proposal was rejected by 7,535 votes, or 50.08%, against and 7,510 votes, or 49.92%, in favor — a difference of just 25 votes.

Murata, the world's largest maker of multilayer ceramic capacitors (MLCCs), plans to begin mass production next year of its Integrated Package Solution (iPaS), a power substrate for artificial intelligence (AI) semiconductors. Major customers are expected to be big tech companies developing AI chips. Murata is expanding its AI power solutions from passive components such as MLCCs and silicon capacitors to substrate-based products.

Murata showcased iPaS at KPCA Show 2026 at Songdo Convensia in Incheon on Sept. 9. Instead of mounting individual capacitors or inductors on a substrate, iPaS integrates their functions into an ultra-compact multilayer substrate. The units can be arranged in arrays, allowing capacitance, electrical characteristics, dimensions and circuit routing to be customized to customer requirements.

Unlike conventional passive components, iPaS allows circuit wiring to be formed on its surface. Internal vias connect the upper and lower wiring layers, enabling power to be delivered vertically. This reduces the surface area occupied by passive components and frees up space for chip mounting.

Conventionally, power modules are placed around an AI accelerator and supply power through substrate wiring. With iPaS, a power module can be positioned directly beneath an AI accelerator, enabling a vertical power delivery (VPD) architecture. The shorter power delivery path reduces losses.

As AI accelerator computing performance increases, so do power consumption and current requirements. Supplying large currents reliably within limited space makes reducing the distance between the power module and AI semiconductor increasingly important. iPaS supports high-density power architectures by reducing the space occupied by passive components while enabling vertical power delivery.

Major customers are expected to include hyperscalers and other big tech companies. As a high-value product, iPaS is expected to be used primarily in high-end products such as AI accelerators rather than general-purpose semiconductors.

"It is a high-priced product, so our customers will be big tech companies rather than makers of general-purpose products," a Murata official said. "It should be in mass production next year."

Murata is developing iPaS in capacitor and inductor versions. The capacitor type integrates high-capacitance functionality into the substrate, reducing the number of surface-mounted MLCCs. The inductor type integrates coil functionality into the substrate to support high-current delivery. Murata also plans to develop a product combining capacitor and inductor functions on a single substrate.

Murata has been developing iPaS for AI and high-performance computing (HPC) applications for several years. It first unveiled samples at FLEX Japan in 2023 and demonstrated a power module using iPaS at the Electronic Components and Technology Conference (ECTC) in 2024. The module reduced the number of surface-mounted capacitors by more than 60% while maintaining voltage fluctuation characteristics similar to conventional designs. Murata has discussed product adoption with graphics processing unit (GPU) and AI accelerator customers, targeting commercialization in 2026.

Murata plans to develop iPaS into a next-generation growth product, targeting annual sales of 50 billion yen within 18 months of mass production. That would be equivalent to about 5% of its capacitor sales of 936.4 billion yen in fiscal 2025, which ran from April 2025 through March 2026.

Simmtech was recognized for its mass-production achievements in Small Outline Compression Attached Memory Module (SOCAMM), a next-generation memory module for artificial intelligence (AI) servers, with three employees and executives receiving industry awards.

Simmtech said Vice President Park Min-ho received the Minister of Trade, Industry and Resources Award at the KPCA Show 2026 reception and awards ceremony held at Songdo Convensia in Incheon on Sept. 9. Park was recognized for establishing a SOCAMM mass-production system, contributing to the competitiveness of industries supporting AI semiconductors and strengthening the domestic supply chain.

Simmtech Chief Executive Officer Jeon Young-sun received the Proud Printed Circuit Board (PCB) and Semiconductor Packaging Achievement Award, while senior researcher Yoo Jong-sang received the Proud PCB and Semiconductor Packaging Industry Professional Award.

Simmtech is also showcasing semiconductor substrates for AI servers at KPCA Show 2026, held from Sept. 9 to 11. Products on display include SOCAMM, next-generation Low Power Compression Attached Memory Module (LPCAMM) substrates, enterprise solid-state drive (SSD) modules and Compute Express Link (CXL) memory modules.

"Winning three awards at this year's KPCA Show reflects recognition of Simmtech's leadership in next-generation semiconductor substrates," a company official said. "We will expand investment in advanced packaging substrate technologies, including SOCAMM module substrates and high-layer-count fine-circuit substrates, while strengthening partnerships with global semiconductor manufacturers to solidify our position among the market leaders."

Duksan Hi-Metal, a semiconductor materials company under Duksan Group, is showcasing solder materials for semiconductors at KPCA Show 2026, held at Songdo Convensia in Incheon from Sept. 9 to 11. The company is strengthening its “total solder solution” business, supplying a full range of materials required for semiconductor bonding.

Solder balls are bonding materials that electrically connect semiconductor chips to substrates. Duksan Hi-Metal holds the largest share of the global solder ball market. As advanced packaging becomes finer with the growth of artificial intelligence (AI) semiconductors and high-performance servers, solder balls are also becoming smaller. Duksan Hi-Metal produces micro solder balls thinner than a human hair with tolerances of several micrometers.

Copper-core solder ball (CSB) products consist of a copper core covered with solder. They use copper’s high thermal conductivity to improve heat dissipation while maintaining a uniform height at package joints.

The company is also displaying solder paste, flux and copper posts (Cu-Post). Solder paste is a cream-like material combining solder powder and flux. Flux removes oxide layers during bonding, helping solder spread evenly across the bonding surface. Cu-Post can replace solder balls and offers high electrical and thermal conductivity, making it suitable for fine-pitch connections.

“This exhibition is an opportunity to showcase increasingly precise next-generation semiconductor interconnect materials based on the technologies we have accumulated over many years,” a Duksan Hi-Metal official said. “We will continue supplying high-performance materials for rapidly growing advanced industries such as AI and lead the global market.”

Kolon Industries said it has completed the expansion of a production line for modified polyphenylene oxide (mPPO), a low-dielectric material used in artificial intelligence semiconductors, and held a completion ceremony on Sept. 8. Attendees included Kolon Industries CEO Huh Sung, Gimcheon Mayor Bae Nak-ho, Gimcheon City Council Chairman Oh Se-gil and Kolon Life Science CEO Lee Hankook.

The company completed the new facilities at its Gimcheon Plant 2 in the second quarter. Production began in the second half after regulatory approvals for hazardous materials and trial operations. Kolon Industries plans to gradually ramp up output through the end of the year.

Kolon Industries’ mPPO offers low-dielectric performance about three to five times higher than epoxy resins used for the same purpose. mPPO is a low-dielectric material used in copper-clad laminates (CCLs), a raw material for semiconductor printed circuit boards (PCBs). Low-dielectric properties that reduce signal loss and heat generation during high-speed signal transmission are important for data-intensive products such as AI accelerators and 6G communications equipment.

The company plans to supply all of the output to global CCL manufacturers. Once trial production is completed and mass production begins in earnest, Kolon Industries expects annual sales from mPPO alone to reach about 200 billion won.

“This expansion marks a turning point for our mPPO business as it enters a full-fledged growth phase,” Huh said. “We will develop next-generation electronic materials into a new growth engine based on differentiated technology and quality competitiveness.”

LG Innotek has unveiled an embedded flip-chip ball grid array (FC-BGA) substrate with silicon capacitors integrated inside the package substrate for artificial intelligence chips. The company is also developing technology to embed active devices and bridges. Demand for embedded substrates, particularly FC-BGAs, is growing as higher-performance AI chips require more stable power delivery.

LG Innotek displayed FC-BGA samples with embedded silicon capacitors at KPCA Show 2026, held at Songdo Convensia in Incheon on Sept. 9. The company showed two structures, with silicon capacitors embedded in either the substrate’s core layer or buildup layer.

The core-layer structure accommodates relatively thick, high-capacitance silicon capacitors. The buildup-layer structure embeds thinner silicon capacitors to reduce overall substrate thickness. LG Innotek said the location and specifications of the embedded silicon capacitors can be varied depending on the semiconductor and substrate design.

A silicon capacitor is a passive component made by forming dielectric and electrode layers on a silicon wafer. It stores power required by a semiconductor and supplies it instantaneously to suppress voltage fluctuations. Conventionally, capacitors are mounted on the substrate surface and deliver power to the chip through copper interconnects. Embedding capacitors inside the substrate shortens the power-delivery distance between the semiconductor and capacitor while freeing up mounting area on the substrate surface.

Silicon capacitors are particularly suited to stable power delivery at high frequencies because of their low equivalent series inductance (ESL). AI semiconductors operate at high speeds and can draw large amounts of power instantaneously. Lower ESL helps suppress voltage fluctuations.

Major silicon capacitor suppliers include Murata and Samsung Electro-Mechanics. TSMC also uses internally produced silicon-based deep trench capacitors (DTCs) in advanced packaging.

LG Innotek has been developing embedding technology for about a decade. It initially embedded multilayer ceramic capacitors (MLCCs) in flip-chip chip-scale packages (FC-CSPs). As the AI semiconductor market expanded, the company unveiled FC-BGA technology with embedded silicon capacitors in 2024 and began applying it to mass-produced products last year.

LG Innotek is also developing technology to embed active devices and bridges inside FC-BGAs, in addition to passive components such as silicon capacitors and inductors. Active devices directly control signals and power, while bridges connect multiple chips over short distances to support high-speed signal transmission. The goal is to expand the substrate’s role beyond simply connecting semiconductors to the mainboard.

“We have applied embedding technology for about 10 years, beginning with passive components inside FC-CSPs,” an LG Innotek official said. “It is attracting renewed attention as FC-BGAs become more advanced.”

“In the past, substrates simply served as a medium for transmitting signals, but they are now evolving to provide functionality themselves by incorporating silicon capacitors, inductors and other components,” the official said. “Moving components from the substrate surface to the inside gives customers greater design flexibility and enables thinner products.”

Simmtech is showcasing next-generation semiconductor substrate technologies, including Small Outline Compression Attached Memory Module (SOCAMM) for artificial intelligence servers, at KPCA Show 2026, held Sept. 9-11 at Songdo Convensia in Incheon.

Key products on display include SOCAMM, next-generation Low Power Compression Attached Memory Module (LPCAMM), enterprise solid-state drive (SSD) modules and Compute Express Link (CXL) memory modules.

Simmtech is the largest supplier of module printed circuit boards (PCBs) and memory semiconductor package substrates used in SOCAMM. Nvidia's Rubin CPU uses eight SOCAMMs, with each SOCAMM containing four low-power DRAM (LPDDR) packages. Simmtech supplies both SOCAMM module PCBs and LPDDR package substrates.

The company is also showcasing ultra-thin and ultra-fine substrate technologies, including Ultra-Thin Substrate, Hybrid Substrate, Small Via, Fine Bond Finger and Fine-Pitch/Dual-Size Small Outline Package (SOP) technologies.

Simmtech is displaying substrate technologies designed to address rising power consumption and heat generation in AI semiconductors. Bar Via, Chunk Via and Thick Cu Pattern technologies improve heat dissipation for high-power semiconductors. The company is also showcasing Rigid-Flex Substrate using Cu Post and Cavity technologies, as well as Wettable Flank substrates.

Simmtech is also presenting preliminary research on glass substrates, a technology that replaces conventional organic cores with glass. The technology can reduce warpage in large-area packages while facilitating ultra-fine wiring and improving signal integrity.

"The importance of substrate technology is greater than ever as the AI semiconductor market grows," a Simmtech official said. "Through this exhibition, we will share our next-generation semiconductor substrate technologies and future vision with customers and industry officials and strengthen our technology leadership in the global market."

TLB will introduce artificial intelligence (AI)-based smart manufacturing technologies at its printed circuit board (PCB) production plant in Ansan. The company will use AI to optimize production conditions and deploy autonomous mobile robots and other technologies on the factory floor.

Ansan City said Sept. 8 that it will develop TLB into a lead AI factory as part of its AI transformation (AX) demonstration industrial complex project at the Banwol and Sihwa National Industrial Complexes. The technologies will first be demonstrated at TLB’s Ansan plant before successful applications are expanded to other manufacturers in the industrial complexes.

The AX demonstration industrial complex project integrates AI and data into manufacturing processes to improve productivity, reduce costs and strengthen corporate competitiveness. A total of 28 billion won in central government, local government and private funding will be invested through 2028.

The project will also establish a manufacturing AI open lab where companies can directly test AI technologies. Universities and research institutions will analyze problems at manufacturing sites and develop and demonstrate the necessary technologies. An AX comprehensive support center will assess each company’s level of AI adoption and connect it with appropriate technologies and experts. Plans also call for a secure data zone where manufacturing, energy and logistics data can be used, as well as an integrated support platform linking manufacturers with AI technology companies.

“The Banwol and Sihwa industrial complexes have been a key foundation supporting Ansan’s industrial competitiveness, and we need to transform them into future-oriented industrial complexes through manufacturing innovation and improvements to working conditions,” Ansan Mayor Lee Min-geun said. “We will create a virtuous cycle in which production innovation using AI and data strengthens corporate competitiveness, while a better working environment attracts young people and talent.”

Simmtech is strengthening cooperation with key domestic and overseas suppliers. The company signed long-term supply agreements with some partners to address uncertainty in raw material procurement.

Simmtech said Sept. 8 that it held its 2026 Simmtech Supplier Day at the Sheraton Grand Incheon Hotel in Songdo. The event was attended by 34 representatives, including chief executives and sales executives, from 17 major domestic and overseas suppliers.

The company discussed joint responses to supply-chain issues with raw material and equipment suppliers and signed long-term supply agreements with some companies. Discussions covered mid- to long-term materials development roadmaps, production capacity expansion plans and measures to address raw material procurement. Working-level meetings were also held in procurement and sales, as well as marketing and development.

Following welcoming remarks by Simmtech CEO Chun Youngsun, executives from each business division gave presentations. The company shared its outlook for the semiconductor memory market and growth prospects for artificial intelligence (AI)-related businesses, the status of its global production bases, package substrate technology trends, manufacturing differentiation strategies and future investment plans. It also presented its business roadmap for SOCAMM, a next-generation memory module substrate for AI servers.

"As demand for AI semiconductors expands and the market for high-end substrates grows rapidly, strengthening the supply chain with key partners has become more important than ever," a Simmtech official said. "We will strengthen mutually beneficial cooperation based on long-term partnerships with our suppliers."

INTEKPLUS has won its first order for glass substrate inspection equipment from a Japanese customer, potentially expanding its substrate inspection business beyond flip-chip ball grid array (FC-BGA) substrates into glass substrates.

According to industry sources on Sept. 8, INTEKPLUS recently received an order from a major Japanese substrate maker for an automated optical inspection (AOI) system for glass substrate R&D. The equipment will be delivered in the second half of this year. The number of systems and the contract value were not disclosed. Given the outlook for the glass substrate market, the order could lead to longer-term business opportunities.

The equipment for Japan builds on INTEKPLUS’s existing substrate inspection technology, enhanced to accommodate the characteristics of glass substrates. Handling technology allows fragile glass to be transported and secured safely during inspection and is designed to work with the customer’s existing glass substrate handling solution. Inspection precision has also been improved to address increasingly fine circuit pitches as advanced packaging substrates become more highly integrated.

The system uses white light scanning interferometer (WSI) technology to measure the three-dimensional shape of glass substrates after plating and wiring processes. It inspects the height and shape of fine bumps, flatness and warpage. Surface defects such as cracks and chipping are detected through automated final visual inspection (AFVI). Precise inspection is particularly important as glass substrates become finer and larger, because even small variations in shape or defects can cause failures in subsequent processes.

INTEKPLUS also made an initial delivery of its next-generation FC-BGA inspection equipment to the same customer, along with an R&D-use panel three-dimensional (3D) inspection system. Both systems are designed for larger and finer substrates. Additional orders are expected as the customer increases production.

The customer is a Japanese semiconductor substrate manufacturer that produces FC-BGA substrates. It recently established a pilot line for advanced packaging and is developing technology to form redistribution layers (RDLs) and other structures on glass substrates or glass interposers after through-glass via (TGV) processing.

INTEKPLUS has conducted sample tests of glass substrates for major South Korean substrate makers and global customers. Using glass substrates produced by customers, the company verified the performance and applicability of its inspection equipment.

Existing INTEKPLUS substrate inspection equipment is also being used for glass substrate development. Two major South Korean substrate makers use existing INTEKPLUS systems at their research centers to inspect internally produced glass substrate samples. Because finished glass substrates have structures similar to FC-BGA substrates, existing 3D measurement and visual inspection technologies can be applied.

Demand is expected to expand from R&D systems to mass-production equipment once customers begin volume production of glass substrates. At the mass-production stage, throughput and handling of large substrates become important alongside inspection precision, increasing demand for new equipment. INTEKPLUS plans to expand sales of glass substrate inspection equipment, primarily to its existing FC-BGA customers.

“Japan is a market where customers have a strong preference for domestic equipment, making it difficult for foreign equipment suppliers to enter, but evaluations and initial deliveries of INTEKPLUS equipment have recently increased as substrates become larger,” an INTEKPLUS official said. “For glass substrates, we have already secured sufficient technology to perform inspections even with equipment previously supplied.”

Samyang Corp. said Sept. 8 that Ahn Tae-jin, a team leader at its Chemical R&D Center's Mobility Tech Center, received a Prime Minister's Commendation at the inaugural Technology Developers' Day ceremony hosted by the Ministry of Science and ICT. Ahn was recognized for leading the development of siloxane-based polycarbonate (Si-PC) compounds for automotive interiors and high-transmittance polycarbonate (PC) materials for automotive daytime running lights.

Ahn has led the development of Si-PC compounds for automotive interiors since 2017. Si-PC combines conventional PC with siloxane components, improving chemical resistance and low-temperature impact resistance, weaknesses of conventional PC. The material retains its impact strength even after exposure to chemicals during painting processes. It has also passed head impact tests, which evaluate safety when an occupant's head strikes interior vehicle components.

The material is currently used in large interior components such as center fascias and crash pads in South Korean vehicles, as well as ambient light covers. Samyang began supplying Si-PC to South Korean automakers in 2019. Cumulative sales through the first quarter of this year reached 10,000 tons, generating more than 50 billion won in revenue. The company has registered 14 related patents, two of which have been recognized as international patents in markets including the US, Japan, China and Europe.

Ahn also led the development of high-transmittance PC for automotive daytime running lights using an isosorbide-based light-transmission enhancer produced by Samyang Innochem. Isosorbide is made by chemically processing starch extracted from plant resources such as corn. When used in plastics, it improves weather resistance, durability and light transmittance. Development began in 2021, with commercial production starting in 2024.

Sales of the high-transmittance PC exceeded 130 tons last year. The material is used in optical components inside automotive headlamps and in optical parts for ambient lighting. It received New Excellent Technology (NET) certification from the Korean Agency for Technology and Standards under the Ministry of Trade, Industry and Resources in 2022. In January, it obtained certification from the Automotive Manufacturers Equipment Compliance Agency (AMECA) in the US. Samyang is pursuing entry into the US market based on the certification.

"The materials recognized through this award are meaningful in that they have strengthened the competitiveness of South Korea's automotive materials industry and contributed to greater self-reliance in materials," Ahn said. "We will continue to focus on developing differentiated materials and expanding commercialization."

aweXome Ray said on Aug. 11 it has secured 7.5 billion won in a Series B bridge financing round, with investors recognizing the technological and commercial potential of its carbon nanotube (CNT)-based extreme ultraviolet (EUV) pellicle membrane.

Strategic investors included S&S Investment, an affiliate of S&S Tech, a manufacturer of photomasks and EUV pellicles, as well as Wonik Investment Partners. Wonik Investment Partners and Hanwha Investment & Securities participated through a jointly managed fund. Other investors included Reinvestment, L&S Venture Capital, KNET Investment Partners, Union Investment Partners, and Ascendo Ventures.

The company said participation by pellicle manufacturers, semiconductor materials and equipment companies, and financial investors demonstrates industry recognition of both the technological competitiveness and commercialization potential of its CNT-based pellicle membrane. It added that the participation of a defense-focused fund jointly managed by Wonik Investment Partners and Hanwha Investment & Securities also highlights the potential application of its CNT fibers and membranes in aerospace and defense.

The proceeds will be used to stabilize production of EUV pellicle membranes, strengthen quality control systems and support customer supply programs. aweXome Ray has established a dedicated cleanroom production line for EUV pellicle membranes in Anyang, Gyeonggi Province, to produce qualification samples and support initial customer shipments. The company said customer evaluations are currently underway and expects initial commercial supply and revenue once qualification is completed.

aweXome Ray is developing CNT-based membranes for EUV pellicles used in advanced semiconductor lithography. Pellicles protect photomasks carrying semiconductor circuit patterns from contamination during the EUV exposure process, requiring both high EUV transmittance and exceptional heat resistance. The company said CNT materials, which are lightweight, thin and highly heat-resistant, are well suited for next-generation pellicles designed for high-power EUV exposure environments.

The company has also strengthened its pellicle business with additional industry expertise. Hong Sung-chul, a senior executive at S&S Investment, joined aweXome Ray's board as an outside director in March. A former Samsung Electronics engineer with experience in semiconductor photomask and pellicle development, Hong will support customer qualification and technical engagement.

In February, Lee Dong-wook, who previously led advanced materials commercialization at LG Chem and EcoPro BM, joined the company as Chief Product Officer (CPO). He oversees the pellicle business division and is responsible for converting research and development achievements into commercial products and customer supply.

aweXome Ray is also participating in a government-funded pellicle technology development project under South Korea's Deep Tech Challenge program administered by the Ministry of SMEs and Startups. The company is carrying out a 3.6 billion won research and development project and has been selected for the Korea Technology Finance Corporation (KIBO) Unicorn Bridge program, securing 600 million won in funding and eligibility for up to 20 billion won in technology guarantees. The company plans to combine private investment with government R&D support to advance its technology and accelerate commercialization.

The company is also stepping up preparations for an initial public offering (IPO). After signing an investment agreement with Jeju Special Self-Governing Province in March, it relocated its headquarters to the Jeju Science Park. Having been selected as one of the province's IPO support companies, aweXome Ray is preparing to appoint an IPO underwriter and undergo a preliminary technology assessment. The company aims to pursue a technology-track listing in 2028 while advancing customer qualification and initial product shipments.

Hong Sung-chul, senior executive at S&S Investment, said aweXome Ray possesses differentiated CNT-based EUV pellicle membrane technology and strong commercialization potential.

"With its production line now in place and customer qualification underway, the company has entered the commercialization stage. We will actively support the establishment of a stable supply chain and successful market entry," he said.

Chief Executive Officer Kim Se-hoon said the new production line and funding round represent an important milestone in transforming aweXome Ray from a research-focused company into an advanced materials supplier capable of serving customers.

"We will successfully complete customer qualification, accelerate commercialization of our CNT-based EUV pellicle membrane, and strengthen our competitiveness in the global semiconductor materials market," he said.

Semiconductor ceramics materials suppliers and their customers are expanding technical collaboration while strengthening industry-academia-research partnerships to reinforce the semiconductor supply chain.

The Engineering Ceramics Division (KECD) of the Korean Ceramic Society said on Aug. 11 it hosted the Semiconductor Process Ceramics Materials and Components Innovation Forum Seminar at the IT Medical Convergence Technology Center in Geumo Techno Valley, Gumi, North Gyeongsang Province. The event was jointly organized with the Semiconductor Process Ceramics Materials and Components Innovation Forum and the Gyeongbuk–Gumi Semiconductor Specialized Complex Promotion Team.

The seminar brought together semiconductor manufacturers and equipment companies including Samsung Electronics, SK hynix, SEMES, Lam Research Korea, Wonik IPS, TES, and Eugene Technology. A total of 30 companies participated overall, including ceramics materials and components suppliers such as Wonik QnC, Komico, Mico Ceramics, TCK, Worldex Industry, CMTX, and LKN Engineering.

The seminar focused on "Ceramics and Plasma Chemistry for Semiconductor Manufacturing Processes." Presentations covered plasma resistance characteristics of ceramic materials used in etching and deposition chambers, particle reduction technologies and design strategies for high-durability ceramics. Researchers from Korea Aerospace University, the Korea Research Institute of Standards and Science (KRISS), Kumoh National Institute of Technology, and the Korea Institute of Materials Science (KIMS) presented their latest research.

Following the seminar, participants held an industry-academia networking session to discuss expanding technical collaboration and joint research among companies and research institutes. The promotion team said it plans to make the seminar a regular event and use it as a platform for future commercial cooperation.

Lee Hyun-kwon, head of the Gyeongbuk–Gumi Semiconductor Specialized Complex Promotion Team, said the event marked the first opportunity for leading semiconductor manufacturers and materials suppliers in South Korea to share commercialization technologies and on-site industry requirements.

He added that the Gyeongbuk–Gumi Semiconductor Specialized Complex will strengthen its role as a collaborative platform linking companies with one another as well as with research institutions.

Avaco said on Aug. 11 it has begun operating a pilot production line, developed in collaboration with affiliate AVATEC, to validate through-glass via (TGV) processes for next-generation semiconductor packaging substrates.

The companies completed construction of the pilot line in the first half of this year. The line supports large-format glass substrates measuring 515 × 510 millimeters and integrates laser drilling, etching, seed-layer deposition and optical inspection into a single process flow.

In addition to evaluating the performance of individual production tools, the pilot line is designed to verify process integration and repeatability in mass production. AVATEC, drawing on its manufacturing experience in display glass etching and thin-film processing, will oversee process operation and production stability.

Avaco has been investing in TGV equipment and process technologies since 2023. Its flagship second-generation TGV laser drilling system, AXIUM AP-250K, is capable of processing up to 10,000 via holes per second using dual optical heads. The company said the system achieves tolerances below 5 micrometers, enabling uniform processing across large-area glass panels.

The company has also secured alkaline wet etching technology and seed-layer deposition equipment for post-laser processing. By combining physical vapor deposition (PVD) with hybrid deposition techniques, Avaco is advancing process technologies for controlling high-aspect-ratio structures and forming uniform metal layers, both of which are critical for TGV substrates.

An optical inspection system has also been installed to inspect defects generated during the manufacturing process. The system performs full inspection of TGV hole geometry and processing quality and will be linked with an automated production line to validate quality control systems for mass production. The company added that it has secured a variety of glass materials through non-disclosure agreements (NDAs) with major glass suppliers.

The two companies plan to provide TGV glass substrate samples incorporating laser drilling through seed-layer deposition in 2026. The samples will range in size from 100 × 100 millimeters to 515 × 510 millimeters. In 2027, they plan to expand sample offerings to include metallized substrates incorporating laser drilling, etching, deposition, via filling and planarization processes.

Avaco said it is currently discussing technology collaboration and future mass production with multiple overseas customers. Once the pilot line has completed process and equipment validation, Avaco plans to expand its TGV equipment business, while AVATEC will participate in commercialization of glass substrates by leveraging its etching technology and process operation expertise.

An Avaco official said the company believes that validating the entire manufacturing process—not just individual tools—is essential for entering the glass substrate market.

"Through our collaboration with AVATEC, we will organically combine equipment, process technology and mass production expertise to establish an integrated TGV solution capable of delivering the production-ready products our customers require," the official said.

Synopex said on Aug. 11 it has received marketing approval from South Korea's Ministry of Food and Drug Safety (MFDS) for its hemodialysis (HD) machine, paving the way for domestically developed products to enter a market that has been entirely dependent on imported systems.

Hemodialysis is a treatment that removes waste products and excess fluid from the blood of patients with chronic kidney disease. The procedure relies on several key medical devices, including hemodialysis machines, dialyzers and water purification systems.

With the approval, Synopex said it has completed the localization of the three core medical device solutions used in hemodialysis: dialyzers (hemodialysis filters), portable water purification systems for hemodialysis machines and HD machines. The company had previously obtained MFDS approvals for 11 hemodialysis filter products, a continuous renal replacement therapy (CRRT) system for critically ill patients and a portable water purification system for hemodialysis equipment.

The HD machine was developed under a national project led by the Korea Medical Device Development Fund (KMDF) in collaboration with researchers from the Department of Nephrology and the Department of Biomedical Engineering at Seoul National University Hospital. In 2024, KMDF designated the localization of the three core hemodialysis medical devices as one of its 10 flagship national projects.

Synopex is developing an upgraded follow-up model of its CRRT system for critically ill patients. It is also working on a mass-production version of its HD machine equipped with hemodiafiltration (HDF) functionality. The company plans to seek regulatory approval and commercialize the HDF-equipped model in the future.

Kang Chang-ho, head of Synopex's Artificial Kidney Sales Division, said the MFDS approval for the HD machine marks "a historic starting point" in establishing medical sovereignty in South Korea's hemodialysis device market, which has long relied entirely on imported products.

He added that the company is preparing for mass production of the HD machine alongside its dialyzers and water purification systems, which are already being introduced to the market.