<p>When mounted inside the traction inverter, TI’s TMCS2100-Q1 multi-axial coreless Hall-effect current sensor enables more efficient, longer-range, and more enjoyable driving experiences for HEVs and EVs.</p>
Marvell’s Bravera SC6 NVMe controller is built with the company’s 6th-generation NANDEdge technology that features a low-density parity-check error correction engine.
As AI moves into embedded systems, engineers must address new challenges around resilience, recovery, telemetry, and auditability. Physical AI introduces operating constraints that cloud infrastructure was never designed to handle.
Amprius announced fourth-quarter production of a 500-Wh/kg battery cell aimed at stratosphere-based communications UAS, which may render SpaceX's LEO satellites obsolete.
As data centers become larger, denser, and more power-hungry, engineers are forced to rethink how they manage safety and maintenance — and how both factor into uptime.
DARPA’s experts chatted with Andy about Lift Challenge 1.0, providing design analyses and unique insights on the innovation process and what Lift Challenge 2.0, announced today, might entail.
DARPA just revealed a new sUAS (Drone) Lift Challenge to be held during summer 2028, where payload is now 220 lb. and the mission also doubles to 10 nm.
Check out this QuickChat to learn how developments are reshaping RF design and test workflows, reducing engineering effort, and helping teams accelerate product development.
Improper e-waste disposal isn’t just an environmental issue. For electronics manufacturers, it carries real compliance, financial, and operational risk.
<p class="MsoBodyText">Kenny McGee, CEO of Component Sense, pictured at the e-waste dump in Agbogbloshie, Ghana, one of the world's largest sites for discarded electronics.</p>
Login
